Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12283329 | Electronic fuse circuit and method for electronic fuse circuit | Min Wang, Chung-Ming Lin, Jin Pang Chi | 2025-04-22 |
| 12224179 | Metal heterojunction structure with capping metal layer | Yi-Sheng Lin, Chi-Jen Liu, Chi-Hsiang Shen, Te-Ming Kung, Chun-Wei Hsu +4 more | 2025-02-11 |
| 11810643 | Word line driving circuit with high access efficiency | Min Wang, Hsiu-Ming Yeh, Chung-Ming Lin | 2023-11-07 |
| 11694756 | Power circuit, electronic fuse circuit, and method for providing power to electronic fuse circuit | Min Wang, Chung-Ming Lin, Jin Pang Chi | 2023-07-04 |
| 11637021 | Metal heterojunction structure with capping metal layer | Yi-Sheng Lin, Chi-Jen Liu, Chi-Hsiang Shen, Te-Ming Kung, Chun-Wei Hsu +4 more | 2023-04-25 |
| 11482450 | Methods of forming an abrasive slurry and methods for chemical- mechanical polishing | Chia Hsuan Lee, Chun-Wei Hsu, Chi-Hsiang Shen, Li-Chieh Wu, Jian-Ci Lin +6 more | 2022-10-25 |
| 11133247 | Vias with metal caps for underlying conductive lines | Chun-Wei Hsu, Chi-Hsiang Shen, Chi-Jen Liu, Yi-Sheng Lin, Yang-Chun Cheng +3 more | 2021-09-28 |
| 11121028 | Semiconductor devices formed using multiple planarization processes | Chun-Wei Hsu, Ling-Fu Nieh, Pinlei Edmund Chu, Chi-Jen Liu, Yi-Sheng Lin +2 more | 2021-09-14 |
| 11094555 | CMP slurry and CMP method | Chun-Wei Hsu, Chi-Jen Liu, Kei-Wei Chen, Liang-Guang Chen, William Weilun Hong +2 more | 2021-08-17 |
| 11037799 | Metal heterojunction structure with capping metal layer | Yi-Sheng Lin, Chi-Jen Liu, Kei-Wei Chen, Liang-Guang Chen, Te-Ming Kung +4 more | 2021-06-15 |
| 10937691 | Methods of forming an abrasive slurry and methods for chemical-mechanical polishing | Chia Hsuan Lee, Chun-Wei Hsu, Chi-Hsiang Shen, Li-Chieh Wu, Jian-Ci Lin +6 more | 2021-03-02 |
| 10692732 | CMP slurry and CMP method | Chun-Wei Hsu, Chi-Jen Liu, Kei-Wei Chen, Liang-Guang Chen, William Weilun Hong +2 more | 2020-06-23 |
| 10636701 | Methods of forming semiconductor devices using multiple planarization processes | Chun-Wei Hsu, Ling-Fu Nieh, Pinlei Edmund Chu, Chi-Jen Liu, Yi-Sheng Lin +2 more | 2020-04-28 |
| 5921516 | Footing structure of a hub | — | 1999-07-13 |