Issued Patents All Time
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12359090 | Composition and method for polishing and integrated circuit | Ji Cui, Chih-Chieh Chang, Kao-Feng Liao, Peng-Chung Jangjian, Chun-Wei Hsu +4 more | 2025-07-15 |
| 12347735 | In-situ defect count detection in post chemical mechanical polishing | Chun-Hung Liao, Jeng-Chi Lin, Liang-Guang Chen, Huang-Lin Chao | 2025-07-01 |
| 12297375 | Slurry composition and method for polishing and integrated circuit | Ji Cui, Liang-Guang Chen, Kei-Wei Chen, Chun-Wei Hsu, Li-Chieh Wu +6 more | 2025-05-13 |
| 12224179 | Metal heterojunction structure with capping metal layer | Yi-Sheng Lin, Chi-Hsiang Shen, Te-Ming Kung, Chun-Wei Hsu, Chia-Wei Ho +4 more | 2025-02-11 |
| 12131944 | Slurry composition, semiconductor structure and method for forming the same | Chun-Wei Hsu, Chih-Chieh Chang, Yi-Sheng Lin, Jian-Ci Lin, Jeng-Chi Lin +4 more | 2024-10-29 |
| 12002684 | Methods for chemical mechanical polishing and forming interconnect structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Chun-Chieh Lin +7 more | 2024-06-04 |
| 11996283 | Method for metal gate surface clean | Shich-Chang Suen, Li-Chieh Wu, He Hui Peng, Liang-Guang Chen, Yung-Chung Chen | 2024-05-28 |
| 11773353 | Semiconductor device cleaning solution, method of use, and method of manufacture | Pinlei Edmund Chu, Chun-Wei Hsu, Ling-Fu Nieh, Liang-Guang Chen, Yi-Sheng Lin | 2023-10-03 |
| 11658065 | Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Chun-Chieh Lin +7 more | 2023-05-23 |
| 11633829 | External heating system for use in chemical mechanical polishing system | Yi-Sheng Lin, Chi-Hsiang Shen, Chun-Wei Hsu, Yang-Chun Cheng, Kei-Wei Chen | 2023-04-25 |
| 11637021 | Metal heterojunction structure with capping metal layer | Yi-Sheng Lin, Chi-Hsiang Shen, Te-Ming Kung, Chun-Wei Hsu, Chia-Wei Ho +4 more | 2023-04-25 |
| 11508585 | Methods for chemical mechanical polishing and forming interconnect structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Chun-Chieh Lin +7 more | 2022-11-22 |
| 11482450 | Methods of forming an abrasive slurry and methods for chemical- mechanical polishing | Chia Hsuan Lee, Chun-Wei Hsu, Chia-Wei Ho, Chi-Hsiang Shen, Li-Chieh Wu +6 more | 2022-10-25 |
| 11410846 | Method for metal gate surface clean | Shich-Chang Suen, Li-Chieh Wu, He Hui Peng, Liang-Guang Chen, Yung-Chung Chen | 2022-08-09 |
| 11133247 | Vias with metal caps for underlying conductive lines | Chia-Wei Ho, Chun-Wei Hsu, Chi-Hsiang Shen, Yi-Sheng Lin, Yang-Chun Cheng +3 more | 2021-09-28 |
| 11121028 | Semiconductor devices formed using multiple planarization processes | Chun-Wei Hsu, Ling-Fu Nieh, Pinlei Edmund Chu, Yi-Sheng Lin, Ting-Hsun Chang +2 more | 2021-09-14 |
| 11114339 | Method for reducing metal plug corrosion and device | Ling-Fu Nieh, Chun-Wei Hsu, Pinlei Edmund Chu, Liang-Guang Chen, Yi-Sheng Lin | 2021-09-07 |
| 11094555 | CMP slurry and CMP method | Chun-Wei Hsu, Kei-Wei Chen, Liang-Guang Chen, William Weilun Hong, Chi-Hsiang Shen +2 more | 2021-08-17 |
| 11037799 | Metal heterojunction structure with capping metal layer | Yi-Sheng Lin, Kei-Wei Chen, Liang-Guang Chen, Te-Ming Kung, William Weilun Hong +4 more | 2021-06-15 |
| 10961487 | Semiconductor device cleaning solution, method of use, and method of manufacture | Pinlei Edmund Chu, Chun-Wei Hsu, Ling-Fu Nieh, Liang-Guang Chen, Yi-Sheng Lin | 2021-03-30 |
| 10937691 | Methods of forming an abrasive slurry and methods for chemical-mechanical polishing | Chia Hsuan Lee, Chun-Wei Hsu, Chia-Wei Ho, Chi-Hsiang Shen, Li-Chieh Wu +6 more | 2021-03-02 |
| 10847359 | Method for metal gate surface clean | Shich-Chang Suen, Li-Chieh Wu, He Hui Peng, Liang-Guang Chen, Yung-Chung Chen | 2020-11-24 |
| 10755934 | Systems and methods for chemical mechanical polish and clean | Shich-Chang Suen, Ying-Liang Chuang, Li-Chieh Wu, Liang-Guang Chen, Ming-Liang Yen | 2020-08-25 |
| 10692732 | CMP slurry and CMP method | Chun-Wei Hsu, Kei-Wei Chen, Liang-Guang Chen, William Weilun Hong, Chi-Hsiang Shen +2 more | 2020-06-23 |
| 10636701 | Methods of forming semiconductor devices using multiple planarization processes | Chun-Wei Hsu, Ling-Fu Nieh, Pinlei Edmund Chu, Yi-Sheng Lin, Ting-Hsun Chang +2 more | 2020-04-28 |