Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12297375 | Slurry composition and method for polishing and integrated circuit | Ji Cui, Chi-Jen Liu, Liang-Guang Chen, Kei-Wei Chen, Chun-Wei Hsu +6 more | 2025-05-13 |
| 12068195 | Metal loss prevention using implantation | Li-Chieh Wu, Kuo-Hsiu Wei, Kei-Wei Chen, Ying-Lang Wang, Su-Hao Liu +5 more | 2024-08-20 |
| 12002684 | Methods for chemical mechanical polishing and forming interconnect structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Chun-Chieh Lin, Wei-Wei Liang +7 more | 2024-06-04 |
| 11710659 | Metal loss prevention using implantation | Li-Chieh Wu, Kuo-Hsiu Wei, Kei-Wei Chen, Ying-Lang Wang, Su-Hao Liu +5 more | 2023-07-25 |
| 11658065 | Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Chun-Chieh Lin, Wei-Wei Liang +7 more | 2023-05-23 |
| 11532514 | Structure and formation method of semiconductor device with conductive feature | Li-Chieh Wu, Kuo-Hsiu Wei, Kei-Wei Chen, Chia Hsuan Lee, Jian-Ci Lin | 2022-12-20 |
| 11508585 | Methods for chemical mechanical polishing and forming interconnect structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Chun-Chieh Lin, Wei-Wei Liang +7 more | 2022-11-22 |
| 11450565 | Ion implant process for defect elimination in metal layer planarization | Chia-Cheng Chen, Huicheng Chang, Fu-Ming Huang, Kei-Wei Chen, Liang-Yin Chen +3 more | 2022-09-20 |
| 11211289 | Metal loss prevention using implantation | Li-Chieh Wu, Kuo-Hsiu Wei, Kei-Wei Chen, Ying-Lang Wang, Su-Hao Liu +5 more | 2021-12-28 |
| 10957587 | Structure and formation method of semiconductor device with conductive feature | Li-Chieh Wu, Kuo-Hsiu Wei, Kei-Wei Chen, Chia Hsuan Lee, Jian-Ci Lin | 2021-03-23 |
| 10643892 | Metal loss prevention using implantation | Li-Chieh Wu, Kuo-Hsiu Wei, Kei-Wei Chen, Ying-Lang Wang, Su-Hao Liu +5 more | 2020-05-05 |
| 9931726 | Wafer edge trimming tool using abrasive tape | Kuo-Hsiu Wei, Kei-Wei Chen, Huai-Tei Yang, Ying-Lang Wang | 2018-04-03 |
| 9829806 | Lithography tool with backside polisher | Kuo-Hsiu Wei, Kei-Wei Chen, Huai-Tei Yang, Ying-Lang Wang | 2017-11-28 |
| 9339912 | Wafer polishing tool using abrasive tape | Kuo-Hsiu Wei, Kei-Wei Chen, Wei-Jen Lo, Ying-Lang Wang | 2016-05-17 |
| 7423879 | Sleeve-tightening heat dissipating module | — | 2008-09-09 |