Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12297375 | Slurry composition and method for polishing and integrated circuit | Ji Cui, Chi-Jen Liu, Liang-Guang Chen, Kei-Wei Chen, Chun-Wei Hsu +6 more | 2025-05-13 |
| 12002684 | Methods for chemical mechanical polishing and forming interconnect structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Chun-Chieh Lin +7 more | 2024-06-04 |
| 11658065 | Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Chun-Chieh Lin +7 more | 2023-05-23 |
| 11508585 | Methods for chemical mechanical polishing and forming interconnect structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Chun-Chieh Lin +7 more | 2022-11-22 |
| 11450565 | Ion implant process for defect elimination in metal layer planarization | Chia-Cheng Chen, Huicheng Chang, Fu-Ming Huang, Kei-Wei Chen, Liang-Yin Chen +3 more | 2022-09-20 |
| 10858544 | Chemical mechanical polishing slurry and chemical mechanical polishing process using the same | — | 2020-12-08 |