Issued Patents All Time
Showing 1–25 of 113 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315809 | Via for semiconductor device and method | Chia-Pang Kuo, Chih-Yi Chang, Ming-Hsiao Hsieh, Wei Hsiang Chan, Ya-Lien Lee +2 more | 2025-05-27 |
| 12220726 | Silicide capacitive micro electromechanical structure and fabrication method thereof | Di Wang | 2025-02-11 |
| 12178817 | Compounds for enhancing PPARγ expression and nuclear translocation and therapeutic use thereof | Jen C. Lin, Hsu-Tung Lee, Yu-Ming Fan, Jui-Chi Tsai, Ying-Chi Du | 2024-12-31 |
| 12172263 | Chemical mechanical planarization tool | Michael Yen, Kao-Feng Liao, Hsin-Ying Ho, Chun-Wen Hsiao, Sheng-Chao Chuang +7 more | 2024-12-24 |
| 12170195 | Post-CMP cleaning and apparatus | Fu-Ming Huang, Liang-Guang Chen, Ting-Kui Chang | 2024-12-17 |
| 12154515 | Displays with reduced temperature luminance sensitivity | Shinya Ono, Chin-Wei Lin, Zino Lee, Chen-Ming Chen | 2024-11-26 |
| 12094770 | Ruthenium-based liner for a copper interconnect | Yao-Min Liu, Ming-Yuan Gao, Ming-Chou Chiang, Shu-Cheng Chin, Huei-Wen Hsieh +4 more | 2024-09-17 |
| 12080594 | Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same | Cheng-Lun Tsai, Huei-Wen Hsieh, Chun-Sheng Chen, Kai-Shiang Kuo, Jen-Wei Liu +2 more | 2024-09-03 |
| 12002684 | Methods for chemical mechanical polishing and forming interconnect structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Wei-Wei Liang +7 more | 2024-06-04 |
| 11908697 | Interconnect structure having a carbon-containing barrier layer | Rueijer Lin, Ya-Lien Lee, Hung-Wen Su | 2024-02-20 |
| 11810857 | Via for semiconductor device and method | Chia-Pang Kuo, Chih-Yi Chang, Ming-Hsiao Hsieh, Wei Hsiang Chan, Ya-Lien Lee +2 more | 2023-11-07 |
| 11772228 | Chemical mechanical polishing apparatus including a multi-zone platen | Ting-Hsun Chang, Hung Yen, Chi-Hsiang Shen, Fu-Ming Huang, Tsung-Hsien Chang +4 more | 2023-10-03 |
| 11728157 | Post-CMP cleaning and apparatus | Fu-Ming Huang, Liang-Guang Chen, Ting-Kui Chang | 2023-08-15 |
| 11679469 | Chemical mechanical planarization tool | Michael Yen, Kao-Feng Liao, Hsin-Ying Ho, Chun-Wen Hsiao, Sheng-Chao Chuang +7 more | 2023-06-20 |
| 11676898 | Diffusion barrier for semiconductor device and method | Chia-Pang Kuo, Huan-Yu Shih, Wen-Hsuan Chen, Cheng-Lun Tsai, Ya-Lien Lee +3 more | 2023-06-13 |
| 11660345 | Method and composition for enhancing the delivery of anti-platelet drugs for the treatment of acute stroke | Jen C. Lin, Hsu-Tung Lee, Yu-Ming Fan, Jui-Chi Tsai | 2023-05-30 |
| 11658065 | Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Wei-Wei Liang +7 more | 2023-05-23 |
| 11532282 | Displays with reduced temperature luminance sensitivity | Shinya Ono, Chin-Wei Lin, Zino Lee, Chen-Ming Chen | 2022-12-20 |
| 11527411 | Interconnect structure having a carbon-containing barrier layer | Rueijer Lin, Ya-Lien Lee, Hung-Wen Su | 2022-12-13 |
| 11527476 | Interconnect structure of semiconductor device | Yao-Min Liu, Chia-Pang Kuo, Chien-Chung Huang, Chih-Yi Chang, Ya-Lien Lee +2 more | 2022-12-13 |
| 11508585 | Methods for chemical mechanical polishing and forming interconnect structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Wei-Wei Liang +7 more | 2022-11-22 |
| 11430692 | Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same | Cheng-Lun Tsai, Huei-Wen Hsieh, Chun-Sheng Chen, Kai-Shiang Kuo, Jen-Wei Liu +2 more | 2022-08-30 |
| 11380762 | Semiconductor device having semiconductor alloy layer adjacent a gate structure | Chien-Chao Huang, Yee-Chia Yeo, Chao-Hsiung Wang, Chenming Hu | 2022-07-05 |
| 11349414 | Apparatus and method for monitoring the relative relationship between the wafer and the chuck | Te-Min Wang, Yu-Ho Ni, Chien-Chung Hou, Cheng-Mao Chien | 2022-05-31 |
| 11322345 | Post-CMP cleaning and apparatus | Fu-Ming Huang, Liang-Guang Chen, Ting-Kui Chang | 2022-05-03 |