Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12359090 | Composition and method for polishing and integrated circuit | Ji Cui, Chi-Jen Liu, Chih-Chieh Chang, Kao-Feng Liao, Peng-Chung Jangjian +4 more | 2025-07-15 |
| 12172263 | Chemical mechanical planarization tool | Michael Yen, Kao-Feng Liao, Hsin-Ying Ho, Chun-Wen Hsiao, Sheng-Chao Chuang +7 more | 2024-12-24 |
| 12131944 | Slurry composition, semiconductor structure and method for forming the same | Chun-Wei Hsu, Chih-Chieh Chang, Yi-Sheng Lin, Jian-Ci Lin, Jeng-Chi Lin +4 more | 2024-10-29 |
| 12002684 | Methods for chemical mechanical polishing and forming interconnect structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Chun-Chieh Lin +7 more | 2024-06-04 |
| 11772228 | Chemical mechanical polishing apparatus including a multi-zone platen | Hung Yen, Chi-Hsiang Shen, Fu-Ming Huang, Chun-Chieh Lin, Tsung-Hsien Chang +4 more | 2023-10-03 |
| 11679469 | Chemical mechanical planarization tool | Michael Yen, Kao-Feng Liao, Hsin-Ying Ho, Chun-Wen Hsiao, Sheng-Chao Chuang +7 more | 2023-06-20 |
| 11658065 | Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Chun-Chieh Lin +7 more | 2023-05-23 |
| 11508585 | Methods for chemical mechanical polishing and forming interconnect structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Chun-Chieh Lin +7 more | 2022-11-22 |
| 11121028 | Semiconductor devices formed using multiple planarization processes | Chun-Wei Hsu, Ling-Fu Nieh, Pinlei Edmund Chu, Chi-Jen Liu, Yi-Sheng Lin +2 more | 2021-09-14 |
| 10636701 | Methods of forming semiconductor devices using multiple planarization processes | Chun-Wei Hsu, Ling-Fu Nieh, Pinlei Edmund Chu, Chi-Jen Liu, Yi-Sheng Lin +2 more | 2020-04-28 |