PJ

Peng-Chung Jangjian

TSMC: 11 patents #2,595 of 12,232Top 25%
Overall (All Time): #435,908 of 4,157,543Top 15%
11
Patents All Time

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
12359090 Composition and method for polishing and integrated circuit Ji Cui, Chi-Jen Liu, Chih-Chieh Chang, Kao-Feng Liao, Chun-Wei Hsu +4 more 2025-07-15
12297375 Slurry composition and method for polishing and integrated circuit Ji Cui, Chi-Jen Liu, Liang-Guang Chen, Kei-Wei Chen, Chun-Wei Hsu +6 more 2025-05-13
12172263 Chemical mechanical planarization tool Michael Yen, Kao-Feng Liao, Hsin-Ying Ho, Chun-Wen Hsiao, Sheng-Chao Chuang +7 more 2024-12-24
11942373 Fin isolation structure for FinFET and method of forming the same Chu-An Lee, Chen-Hao Wu, Chun-Wen Hsiao, Teng-Chun Tsai, Huang-Lin Chao 2024-03-26
11688644 Fin isolation structure for FinFET and method of forming the same Chu-An Lee, Chen-Hao Wu, Chun-Wen Hsiao, Teng-Chun Tsai, Huang-Lin Chao 2023-06-27
11679469 Chemical mechanical planarization tool Michael Yen, Kao-Feng Liao, Hsin-Ying Ho, Chun-Wen Hsiao, Sheng-Chao Chuang +7 more 2023-06-20
11189727 FinFET contacts and method forming same Kao-Feng Liao, Chun-Wen Hsiao, Hsin-Ying Ho, Sheng-Chao Chuang 2021-11-30
10998239 Fin isolation structure for FinFET and method of forming the same Chu-An Lee, Chen-Hao Wu, Chun-Wen Hsiao, Teng-Chun Tsai, Huang-Lin Chao 2021-05-04
10714395 Fin isolation structure for FinFET and method of forming the same Chu-An Lee, Chen-Hao Wu, Chun-Wen Hsiao, Teng-Chun Tsai, Huang-Lin Chao 2020-07-14
9333619 Adaptive endpoint method for pad life effect on chemical mechanical polishing Chu-An Lee, Hui-Chi Huang 2016-05-10
8367429 Adaptive endpoint method for pad life effect on chemical mechanical polishing Chu-An Lee, Hui-Chi Huang 2013-02-05