Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224179 | Metal heterojunction structure with capping metal layer | Yi-Sheng Lin, Chi-Jen Liu, Te-Ming Kung, Chun-Wei Hsu, Chia-Wei Ho +4 more | 2025-02-11 |
| 12002684 | Methods for chemical mechanical polishing and forming interconnect structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Chun-Chieh Lin +7 more | 2024-06-04 |
| 11772228 | Chemical mechanical polishing apparatus including a multi-zone platen | Ting-Hsun Chang, Hung Yen, Fu-Ming Huang, Chun-Chieh Lin, Tsung-Hsien Chang +4 more | 2023-10-03 |
| 11658065 | Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Chun-Chieh Lin +7 more | 2023-05-23 |
| 11637021 | Metal heterojunction structure with capping metal layer | Yi-Sheng Lin, Chi-Jen Liu, Te-Ming Kung, Chun-Wei Hsu, Chia-Wei Ho +4 more | 2023-04-25 |
| 11633829 | External heating system for use in chemical mechanical polishing system | Yi-Sheng Lin, Chi-Jen Liu, Chun-Wei Hsu, Yang-Chun Cheng, Kei-Wei Chen | 2023-04-25 |
| 11508585 | Methods for chemical mechanical polishing and forming interconnect structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Chun-Chieh Lin +7 more | 2022-11-22 |
| 11482450 | Methods of forming an abrasive slurry and methods for chemical- mechanical polishing | Chia Hsuan Lee, Chun-Wei Hsu, Chia-Wei Ho, Li-Chieh Wu, Jian-Ci Lin +6 more | 2022-10-25 |
| 11133247 | Vias with metal caps for underlying conductive lines | Chia-Wei Ho, Chun-Wei Hsu, Chi-Jen Liu, Yi-Sheng Lin, Yang-Chun Cheng +3 more | 2021-09-28 |
| 11094555 | CMP slurry and CMP method | Chun-Wei Hsu, Chi-Jen Liu, Kei-Wei Chen, Liang-Guang Chen, William Weilun Hong +2 more | 2021-08-17 |
| 11037799 | Metal heterojunction structure with capping metal layer | Yi-Sheng Lin, Chi-Jen Liu, Kei-Wei Chen, Liang-Guang Chen, Te-Ming Kung +4 more | 2021-06-15 |
| 10937691 | Methods of forming an abrasive slurry and methods for chemical-mechanical polishing | Chia Hsuan Lee, Chun-Wei Hsu, Chia-Wei Ho, Li-Chieh Wu, Jian-Ci Lin +6 more | 2021-03-02 |
| 10692732 | CMP slurry and CMP method | Chun-Wei Hsu, Chi-Jen Liu, Kei-Wei Chen, Liang-Guang Chen, William Weilun Hong +2 more | 2020-06-23 |