Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354958 | Semiconductor devices and methods of formation | Shu-Cheng Chin, Chih-Chien Chi, Hsin-Ying Peng, Jau-Jiun Huang, Ya-Lien Lee +2 more | 2025-07-08 |
| 12322649 | Interconnect structure of semiconductor device | Yao-Min Liu, Shu-Cheng Chin, Chih-Chien Chi, Cheng-Hui Weng, Hung-Wen Su +1 more | 2025-06-03 |
| 12315809 | Via for semiconductor device and method | Chih-Yi Chang, Ming-Hsiao Hsieh, Wei Hsiang Chan, Ya-Lien Lee, Chien-Chung Huang +2 more | 2025-05-27 |
| 12068194 | Selective deposition of metal barrier in damascene processes | Ya-Lien Lee, Chieh-Yi Shen | 2024-08-20 |
| 11837500 | Selective deposition of metal barrier in damascene processes and the structures formed thereof | Ya-Lien Lee, Chieh-Yi Shen | 2023-12-05 |
| 11810857 | Via for semiconductor device and method | Chih-Yi Chang, Ming-Hsiao Hsieh, Wei Hsiang Chan, Ya-Lien Lee, Chien-Chung Huang +2 more | 2023-11-07 |
| 11676898 | Diffusion barrier for semiconductor device and method | Huan-Yu Shih, Wen-Hsuan Chen, Cheng-Lun Tsai, Ya-Lien Lee, Cheng-Hui Weng +3 more | 2023-06-13 |
| 11527476 | Interconnect structure of semiconductor device | Yao-Min Liu, Chien-Chung Huang, Chih-Yi Chang, Ya-Lien Lee, Chun-Chieh Lin +2 more | 2022-12-13 |
| 11398406 | Selective deposition of metal barrier in damascene processes | Ya-Lien Lee, Chieh-Yi Shen | 2022-07-26 |
| 11183424 | Barrier layer formation for conductive feature | Ya-Lien Lee | 2021-11-23 |
| 11043413 | Barrier layer formation for conductive feature | Ya-Lien Lee | 2021-06-22 |
| 11043416 | Gradient atomic layer deposition | Ya-Lien Lee | 2021-06-22 |
| 10741442 | Barrier layer formation for conductive feature | Ya-Lien Lee | 2020-08-11 |
| 10672652 | Gradient atomic layer deposition | Ya-Lien Lee | 2020-06-02 |
| D845226 | Electrode of a solar cell substrate | Tzu-Chin Hsu, Kun-Chih Lin, Han-Cheng Lee | 2019-04-09 |
| 9923102 | Solar cell | Tzu-Chin Hsu, Kun-Chih Lin, Han-Cheng Lee | 2018-03-20 |