Issued Patents All Time
Showing 1–25 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368103 | Diffusion barrier layer for conductive via to decrease contact resistance | Hsiu-Wen Hsueh, Chii-Ping Chen, Neng-Jye Yang, An-Jiao Fu, Ya-Ching Tseng | 2025-07-22 |
| 12354958 | Semiconductor devices and methods of formation | Shu-Cheng Chin, Chih-Chien Chi, Hsin-Ying Peng, Jau-Jiun Huang, Kuan-Chia Chen +2 more | 2025-07-08 |
| 12315809 | Via for semiconductor device and method | Chia-Pang Kuo, Chih-Yi Chang, Ming-Hsiao Hsieh, Wei Hsiang Chan, Chien-Chung Huang +2 more | 2025-05-27 |
| 12068194 | Selective deposition of metal barrier in damascene processes | Chia-Pang Kuo, Chieh-Yi Shen | 2024-08-20 |
| 11961761 | Mitigating pattern collapse | Chih-Yuan Ting, Chung-Wen Wu, Jeng-Shiou Chen | 2024-04-16 |
| 11908697 | Interconnect structure having a carbon-containing barrier layer | Rueijer Lin, Chun-Chieh Lin, Hung-Wen Su | 2024-02-20 |
| 11851749 | Semiconductor device, method and machine of manufacture | Jen-Chun Wang, Chih-Chien Chi, Hung-Wen Su | 2023-12-26 |
| 11837500 | Selective deposition of metal barrier in damascene processes and the structures formed thereof | Chia-Pang Kuo, Chieh-Yi Shen | 2023-12-05 |
| 11810857 | Via for semiconductor device and method | Chia-Pang Kuo, Chih-Yi Chang, Ming-Hsiao Hsieh, Wei Hsiang Chan, Chien-Chung Huang +2 more | 2023-11-07 |
| 11742291 | Diffusion barrier layer for conductive via to decrease contact resistance | Hsiu-Wen Hsueh, Chii-Ping Chen, Neng-Jye Yang, An-Jiao Fu, Ya-Ching Tseng | 2023-08-29 |
| 11676898 | Diffusion barrier for semiconductor device and method | Chia-Pang Kuo, Huan-Yu Shih, Wen-Hsuan Chen, Cheng-Lun Tsai, Cheng-Hui Weng +3 more | 2023-06-13 |
| 11527411 | Interconnect structure having a carbon-containing barrier layer | Rueijer Lin, Chun-Chieh Lin, Hung-Wen Su | 2022-12-13 |
| 11527476 | Interconnect structure of semiconductor device | Yao-Min Liu, Chia-Pang Kuo, Chien-Chung Huang, Chih-Yi Chang, Chun-Chieh Lin +2 more | 2022-12-13 |
| 11398406 | Selective deposition of metal barrier in damascene processes | Chia-Pang Kuo, Chieh-Yi Shen | 2022-07-26 |
| 11362035 | Diffusion barrier layer for conductive via to decrease contact resistance | Hsiu-Wen Hsueh, Chii-Ping Chen, Neng-Jye Yang, An-Jiao Fu, Ya-Ching Tseng | 2022-06-14 |
| 11345991 | Semiconductor device, method and machine of manufacture | Jen-Chun Wang, Chih-Chien Chi, Hung-Wen Su | 2022-05-31 |
| 11183424 | Barrier layer formation for conductive feature | Chia-Pang Kuo | 2021-11-23 |
| 11177168 | Device and method for reducing contact resistance of a metal | Hung-Wen Su, Kuei-Pin Lee, Yu-Hung Lin, Yu-Min Chang | 2021-11-16 |
| 11145542 | Global dielectric and barrier layer | — | 2021-10-12 |
| 11062909 | Interconnect structure having a carbon-containing barrier layer | Rueijer Lin, Chun-Chieh Lin, Hung-Wen Su | 2021-07-13 |
| 11043416 | Gradient atomic layer deposition | Chia-Pang Kuo | 2021-06-22 |
| 11043413 | Barrier layer formation for conductive feature | Chia-Pang Kuo | 2021-06-22 |
| 10950495 | Mitigating pattern collapse | Chih-Yuan Ting, Chung-Wen Wu, Jeng-Shiou Chen | 2021-03-16 |
| 10867800 | Method of forming an interconnect structure having a carbon-containing barrier layer | Rueijer Lin, Chun-Chieh Lin, Hung-Wen Su | 2020-12-15 |
| 10741442 | Barrier layer formation for conductive feature | Chia-Pang Kuo | 2020-08-11 |