Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177168 | Device and method for reducing contact resistance of a metal | Ya-Lien Lee, Hung-Wen Su, Yu-Hung Lin, Yu-Min Chang | 2021-11-16 |
| 10276431 | Device and method for reducing contact resistance of a metal | Ya-Lien Lee, Hung-Wen Su, Yu-Hung Lin, Yu-Min Chang | 2019-04-30 |
| 9892963 | Device and method for reducing contact resistance of a metal | Ya-Lien Lee, Hung-Wen Su, Yu-Hung Lin, Yu-Min Chang | 2018-02-13 |
| 9159666 | Device and method for reducing contact resistance of a metal | Ya-Lien Lee, Hung-Wen Su, Yu-Hung Lin, Yu-Min Chang | 2015-10-13 |
| 9064934 | Barrier layer for copper interconnect | Yu-Hung Lin, Chi-Yu Chou, Chen-Kuang Lien, Yu-Chang Hsiao, Yao-Hsiang Liang +1 more | 2015-06-23 |
| 8872342 | Barrier layer for copper interconnect | Yu-Hung Lin, Chi-Yu Chou, Chen-Kuang Lien, Yu-Chang Hsiao, Yao-Hsiang Liang +1 more | 2014-10-28 |
| 8778801 | Method for forming seed layer structure | Chen-Bin Chiang, Hung-Chih Wang, Chi-Yu Chou, Yao-Hsiang Liang | 2014-07-15 |
| 8722531 | Barrier layer for copper interconnect | Yu-Hung Lin, Chi-Yu Chou, Chen-Kuang Lien, Yu-Chang Hsiao, Yao-Hsiang Liang +1 more | 2014-05-13 |