Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12382693 | Semiconductor device and methods of formation | Cheng-Wei Chang, Shahaji B. More, Chun-Chieh Wang, Yueh-Ching Pai | 2025-08-05 |
| 12170202 | Formation and in-situ etching processes for metal layers | Po-Yu Lin, Hsien-Ming Lee, Huai-Tei Yang, Chun-Chieh Wang, Yueh-Ching Pai +3 more | 2024-12-17 |
| 11545363 | Formation and in-situ etching processes for metal layers | Po-Yu Lin, Hsien-Ming Lee, Huai-Tei Yang, Chun-Chieh Wang, Yueh-Ching Pai +3 more | 2023-01-03 |
| 10872769 | Formation and in-situ etching processes for metal layers | Po-Yu Lin, Hsien-Ming Lee, Huai-Tei Yang, Chun-Chieh Wang, Yueh-Ching Pai +3 more | 2020-12-22 |
| 10535523 | Formation and in-situ etching processes for metal layers | Po-Yu Lin, Hsien-Ming Lee, Huai-Tei Yang, Chun-Chieh Wang, Yueh-Ching Pai +3 more | 2020-01-14 |
| 9064934 | Barrier layer for copper interconnect | Yu-Hung Lin, Kuei-Pin Lee, Chen-Kuang Lien, Yu-Chang Hsiao, Yao-Hsiang Liang +1 more | 2015-06-23 |
| 8872342 | Barrier layer for copper interconnect | Yu-Hung Lin, Kuei-Pin Lee, Chen-Kuang Lien, Yu-Chang Hsiao, Yao-Hsiang Liang +1 more | 2014-10-28 |
| 8778801 | Method for forming seed layer structure | Chen-Bin Chiang, Hung-Chih Wang, Kuei-Pin Lee, Yao-Hsiang Liang | 2014-07-15 |
| 8722531 | Barrier layer for copper interconnect | Yu-Hung Lin, Kuei-Pin Lee, Chen-Kuang Lien, Yu-Chang Hsiao, Yao-Hsiang Liang +1 more | 2014-05-13 |