YL

Yao-Hsiang Liang

TSMC: 39 patents #877 of 12,232Top 8%
Overall (All Time): #81,494 of 4,157,543Top 2%
39
Patents All Time

Issued Patents All Time

Showing 1–25 of 39 patents

Patent #TitleCo-InventorsDate
12362273 Conductive structures and methods of fabrication thereof Jun-Nan Nian, Jian-Shin Tsai, Ming-Ching CHUNG, Chun-I Liao 2025-07-15
12341055 Method of manufacturing semiconductor devices and semiconductor devices Jun-Nan Nian, Ming-Ching CHUNG, Hsueh-Han Lu, Chun-Ju WU 2025-06-24
12142628 Method of forming semiconductor device Chi-Ming Lu, Chih-Hui Huang, Sheng-Chan Li, Jung-Chih Tsao 2024-11-12
11854980 Method for forming titanium nitride barrier with small surface grains in interconnects Chi-Ming Lu, Jung-Chih Tsao, Chih-Chang Huang, Han-Chieh Huang 2023-12-26
11603602 Method for controlling electrochemical deposition to avoid defects in interconnect structures Jun-Nan Nian, Shiu-Ko JangJian, Yu-Ren PENG, Ting-Chun Wang 2023-03-14
11417700 Image sensing device and manufacturing method thereof Chih-Chang Huang, Chi-Ming Lu, Jian Chen, Jung-Chih Tsao 2022-08-16
11404470 Method of forming deep trench isolation in radiation sensing substrate and image sensor device Chi-Ming Lu, Chih-Hui Huang, Jung-Chih Tsao, Chih-Chang Huang, Ching-Ho Hsu 2022-08-02
11387274 Method of forming semiconductor device Chi-Ming Lu, Chih-Hui Huang, Sheng-Chan Li, Jung-Chih Tsao 2022-07-12
11158659 Semiconductor device structure with anti-acid layer and method for forming the same Yin-Shuo Chu, Chi-Chung Yu, Li-Yen Fang, Tain-Shang Chang, Min-Chih Tsai 2021-10-26
11015260 Method for controlling electrochemical deposition to avoid defects in interconnect structures Jun-Nan Nian, Shiu-Ko JangJian, Yu-Ren PENG, Ting-Chun Wang 2021-05-25
10867889 Method of manufacturing semiconductor structure Li-Yen Fang, Chih-Chang Huang, Jung-Chih Tsao, Yu-Ku Lin 2020-12-15
10796996 Semiconductor device and method of forming the same Chi-Ming Lu, Jung-Chih Tsao, Chih-Chang Huang, Han-Chieh Huang 2020-10-06
10741601 Image sensing device and manufacturing method thereof Chih-Chang Huang, Chi-Ming Lu, Jian Chen, Jung-Chih Tsao 2020-08-11
10510798 Method of forming deep trench isolation in radiation sensing substrate and image sensor device Chi-Ming Lu, Chih-Hui Huang, Jung-Chih Tsao, Chih-Chang Huang, Ching-Ho Hsu 2019-12-17
10475847 Semiconductor device having stress-neutralized film stack and method of fabricating same Chi-Ming Lu, Chih-Hui Huang, Sheng-Chan Li, Jung-Chih Tsao 2019-11-12
10157953 Image sensing device and manufacturing method thereof Chih-Chang Huang, Chi-Ming Lu, Jian Chen, Jung-Chih Tsao 2018-12-18
10134801 Method of forming deep trench isolation in radiation sensing substrate and image sensor device Chi-Ming Lu, Chih-Hui Huang, Jung-Chih Tsao, Chih-Chang Huang, Ching-Ho Hsu 2018-11-20
10074594 Semiconductor structure and manufacturing method thereof Li-Yen Fang, Chih-Chang Huang, Jung-Chih Tsao, Yu-Ku Lin 2018-09-11
9991204 Through via structure for step coverage improvement Li-Yen Fang, Jung-Chih Tsao, Yu-Ku Lin 2018-06-05
9966304 Method for forming interconnect structure Yu-Hung Lin, Ching-Fu Yeh, Hsin-Chen Tsai, Yu-Min Chang, Shih-Chi Lin 2018-05-08
9859124 Method of manufacturing semiconductor device with recess Li-Yen Fang, Jung-Chih Tsao, Yu-Ku Lin 2018-01-02
9711454 Through via structure for step coverage improvement Li-Yen Fang, Jung-Chih Tsao, Yu-Ku Lin 2017-07-18
9691804 Image sensing device and manufacturing method thereof Chih-Chang Huang, Chi-Ming Lu, Jian Chen, Jung-Chih Tsao 2017-06-27
9666545 Semiconductor device with advanced pad structure resistant to plasma damage and metnod for forming same Hung-Chih Wang 2017-05-30
9385081 Semiconductor device with advanced pad structure resistant to plasma damage and method for forming the same Hung-Chih Wang 2016-07-05