Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027419 | Semiconductor device including liner structure | Yu-Chen Chan, Guanyu Luo, Meng-Pei Lu, Chao-Hsien Peng, Shin-Yi Yang +2 more | 2024-07-02 |
| 11948837 | Semiconductor structure having vertical conductive graphene and method for forming the same | Chin-Lung Chung, Shu-Wei Li, Yu-Chen Chan, Shin-Yi Yang, Ming-Han Lee | 2024-04-02 |
| 10930552 | Method of semiconductor integrated circuit fabrication | Chao-Hsien Peng, Hsien-Chang Wu, Hsiang-Huan Lee | 2021-02-23 |
| 10651279 | Semiconductor interconnect structure having graphene-capped metal interconnects | Shin-Yi Yang, Ming-Han Lee, Shau-Lin Shue | 2020-05-12 |
| 10453746 | Method of semiconductor integrated circuit fabrication | Chao-Hsien Peng, Hsien-Chang Wu, Hsiang-Huan Lee | 2019-10-22 |
| 10163698 | Interconnect structure and manufacturing method thereof | Ming-Han Lee | 2018-12-25 |
| 10164018 | Semiconductor interconnect structure having graphene-capped metal interconnects | Shin-Yi Yang, Ming-Han Lee, Shau-Lin Shue | 2018-12-25 |
| 9984975 | Barrier structure for copper interconnect | Yu-Hung Lin, Yu-Min Chang, You-Hua Chou, Chih-Wei Chang | 2018-05-29 |
| 9966304 | Method for forming interconnect structure | Yu-Hung Lin, Hsin-Chen Tsai, Yao-Hsiang Liang, Yu-Min Chang, Shih-Chi Lin | 2018-05-08 |
| 9966339 | Barrier structure for copper interconnect | Yu-Hung Lin, Yu-Min Chang, You-Hua Chou, Chih-Wei Chang, Sheng-Hsuan Lin | 2018-05-08 |
| 9947583 | Method of semiconductor integrated circuit fabrication | Chao-Hsien Peng, Hsien-Chang Wu, Hsiang-Huan Lee | 2018-04-17 |
| 9640431 | Method for via plating with seed layer | Shin-Yi Yang, Tz-Jun Kuo, Hsiang-Huan Lee, Ming-Han Lee | 2017-05-02 |
| 9613854 | Method and apparatus for back end of line semiconductor device processing | Shin-Yi Yang, Hsiang-Huan Lee, Ming-Han Lee, Pei-Yin Liou | 2017-04-04 |
| 9607891 | Aluminum interconnection apparatus | Hsiang-Huan Lee | 2017-03-28 |
| 9570347 | Method of semiconductor integrated circuit fabrication | Chao-Hsien Peng, Hsien-Chang Wu, Hsiang-Huan Lee | 2017-02-14 |
| 9455184 | Aluminum interconnection apparatus | Hsiang-Huan Lee | 2016-09-27 |
| 9391023 | Method for producing salicide and a carbon nanotube metal contact | Yu-Hung Lin, Chih-Wei Chang | 2016-07-12 |
| 9324608 | Method for via plating with seed layer | Shin-Yi Yang, Tz-Jun Kuo, Hsiang-Huan Lee, Ming-Han Lee | 2016-04-26 |
| 9142509 | Copper interconnect structure and method for forming the same | Chen-Hua Yu, Shau-Lin Shue, Hsiang-Huan Lee | 2015-09-22 |
| 9142505 | Method and apparatus for back end of line semiconductor device processing | Shin-Yi Yang, Hsiang-Huan Lee, Ming-Han Lee, Pei-Yin Liou | 2015-09-22 |
| 9054161 | Method of semiconductor integrated circuit fabrication | Hsiang-Huan Lee, Chao-Hsien Peng, Hsien-Chang Wu | 2015-06-09 |
| 9054163 | Method for via plating with seed layer | Shin-Yi Yang, Tz-Jun Kuo, Hsiang-Huan Lee, Ming-Han Lee | 2015-06-09 |
| 8941239 | Copper interconnect structure and method for forming the same | Chen-Hua Yu, Shau-Lin Shue, Hsiang-Huan Lee | 2015-01-27 |
| 8772934 | Aluminum interconnection apparatus | Hsiang-Huan Lee | 2014-07-08 |
| 8735280 | Method of semiconductor integrated circuit fabrication | Hsiang-Huan Lee, Chao-Hsien Peng, Hsien-Chang Wu | 2014-05-27 |