Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347776 | Integrated chip with graphene based interconnect | Shin-Yi Yang, Meng-Pei Lu, Ming-Han Lee, Shau-Lin Shue | 2025-07-01 |
| 12300599 | Method for forming semiconductor structure | Meng-Pei Lu, Shin-Yi Yang, Shu-Wei Li, Ming-Han Lee | 2025-05-13 |
| 12218060 | Integrated chip with graphene based interconnect | Shin-Yi Yang, Meng-Pei Lu, Ming-Han Lee, Shau-Lin Shue | 2025-02-04 |
| 12051643 | Hybrid via interconnect structure | Shin-Yi Yang, Ming-Han Lee | 2024-07-30 |
| 11978663 | Integrated circuit interconnect structure having discontinuous barrier layer and air gap | Shin-Yi Yang, Ming-Han Lee | 2024-05-07 |
| 11948837 | Semiconductor structure having vertical conductive graphene and method for forming the same | Ching-Fu Yeh, Shu-Wei Li, Yu-Chen Chan, Shin-Yi Yang, Ming-Han Lee | 2024-04-02 |
| 11682616 | Semiconductor structure and method for forming the same | Meng-Pei Lu, Shin-Yi Yang, Shu-Wei Li, Ming-Han Lee | 2023-06-20 |
| 11605558 | Integrated circuit interconnect structure having discontinuous barrier layer and air gap | Shin-Yi Yang, Ming-Han Lee | 2023-03-14 |
| 11114374 | Graphene enabled selective barrier layer formation | Shin-Yi Yang, Guanyu Luo, Ming-Han Lee, Shau-Lin Shue | 2021-09-07 |