Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417981 | Semiconductor device including graphene interconnect and method of making the semiconductor device | Shu-Wei Li, Shin-Yi Yang, Ming-Han Lee | 2025-09-16 |
| 12211740 | Interconnect structure and methods of forming the same | Shu-Wei Li, Shin-Yi Yang, Ming-Han Lee, Shau-Lin Shue | 2025-01-28 |
| 12113021 | Graphene-assisted low-resistance interconnect structures and methods of formation thereof | Shin-Yi Yang, Ming-Han Lee, Hai-Ching Chen, Shau-Lin Shue | 2024-10-08 |
| 12068253 | Semiconductor structure with two-dimensional conductive structures | Shu-Wei Li, Meng-Pei Lu, Shin-Yi Yang, Ming-Han Lee | 2024-08-20 |
| 12068254 | Interconnection structure and methods of forming the same | Shu-Wei Li, Shin-Yi Yang, Ming-Han Lee, Shau-Lin Shue | 2024-08-20 |
| 12051645 | Two 2D capping layers on interconnect conductive structure to increase interconnect structure reliability | Shu-Wei Li, Shin-Yi Yang, Ming-Han Lee | 2024-07-30 |
| 12027419 | Semiconductor device including liner structure | Ching-Fu Yeh, Guanyu Luo, Meng-Pei Lu, Chao-Hsien Peng, Shin-Yi Yang +2 more | 2024-07-02 |
| 11948837 | Semiconductor structure having vertical conductive graphene and method for forming the same | Ching-Fu Yeh, Chin-Lung Chung, Shu-Wei Li, Shin-Yi Yang, Ming-Han Lee | 2024-04-02 |
| 11908794 | Protection liner on interconnect wire to enlarge processing window for overlying interconnect via | Shin-Yi Yang, Hsin-Yen Huang, Ming-Han Lee, Shau-Lin Shue, Meng-Pei Lu | 2024-02-20 |
| 11710700 | Graphene-assisted low-resistance interconnect structures and methods of formation thereof | Shin-Yi Yang, Ming-Han Lee, Hai-Ching Chen, Shau-Lin Shue | 2023-07-25 |
| 11670595 | Semiconductor device structure and methods of forming the same | Shu-Wei Li, Shin-Yi Yang, Ming-Han Lee, Shau-Lin Shue | 2023-06-06 |
| 11640940 | Methods of forming interconnection structure including conductive graphene layers | Shu-Wei Li, Shin-Yi Yang, Ming-Han Lee, Shau-Lin Shue | 2023-05-02 |
| 11532549 | Two 2D capping layers on interconnect conductive structure to increase interconnect structure reliability | Shu-Wei Li, Shin-Yi Yang, Ming-Han Lee | 2022-12-20 |
| 11309241 | Protection liner on interconnect wire to enlarge processing window for overlying interconnect via | Shin-Yi Yang, Hsin-Yen Huang, Ming-Han Lee, Shau-Lin Shue, Meng-Pei Lu | 2022-04-19 |
| 11081447 | Graphene-assisted low-resistance interconnect structures and methods of formation thereof | Shin-Yi Yang, Ming-Han Lee, Hai-Ching Chen, Shau-Lin Shue | 2021-08-03 |
| 11011467 | Method of forming interconnection structure | Shin-Yi Yang, Ming-Han Lee | 2021-05-18 |
| 10741493 | Interconnection structure and method for forming the same | Shin-Yi Yang, Ming-Han Lee | 2020-08-11 |
| 10141260 | Interconnection structure and method for forming the same | Shin-Yi Yang, Ming-Han Lee | 2018-11-27 |