Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417981 | Semiconductor device including graphene interconnect and method of making the semiconductor device | Yu-Chen Chan, Shin-Yi Yang, Ming-Han Lee | 2025-09-16 |
| 12300599 | Method for forming semiconductor structure | Meng-Pei Lu, Shin-Yi Yang, Chin-Lung Chung, Ming-Han Lee | 2025-05-13 |
| 12211740 | Interconnect structure and methods of forming the same | Yu-Chen Chan, Shin-Yi Yang, Ming-Han Lee, Shau-Lin Shue | 2025-01-28 |
| 12068253 | Semiconductor structure with two-dimensional conductive structures | Yu-Chen Chan, Meng-Pei Lu, Shin-Yi Yang, Ming-Han Lee | 2024-08-20 |
| 12068254 | Interconnection structure and methods of forming the same | Yu-Chen Chan, Shin-Yi Yang, Ming-Han Lee, Shau-Lin Shue | 2024-08-20 |
| 12062612 | Semiconductor device structure and methods of forming the same | Guanyu Luo, Shin-Yi Yang, Ming-Han Lee | 2024-08-13 |
| 12051645 | Two 2D capping layers on interconnect conductive structure to increase interconnect structure reliability | Yu-Chen Chan, Shin-Yi Yang, Ming-Han Lee | 2024-07-30 |
| 11948837 | Semiconductor structure having vertical conductive graphene and method for forming the same | Ching-Fu Yeh, Chin-Lung Chung, Yu-Chen Chan, Shin-Yi Yang, Ming-Han Lee | 2024-04-02 |
| 11682616 | Semiconductor structure and method for forming the same | Meng-Pei Lu, Shin-Yi Yang, Chin-Lung Chung, Ming-Han Lee | 2023-06-20 |
| 11682620 | Graded metallic liner for metal interconnect structures and methods for forming the same | Guanyu Luo, Shin-Yi Yang, Ming-Han Lee | 2023-06-20 |
| 11670595 | Semiconductor device structure and methods of forming the same | Yu-Chen Chan, Shin-Yi Yang, Ming-Han Lee, Shau-Lin Shue | 2023-06-06 |
| 11652055 | Interconnect structure with hybrid barrier layer | Shin-Yi Yang, Ming-Han Lee, Shau-Lin Shue | 2023-05-16 |
| 11640940 | Methods of forming interconnection structure including conductive graphene layers | Yu-Chen Chan, Shin-Yi Yang, Ming-Han Lee, Shau-Lin Shue | 2023-05-02 |
| 11605591 | Semiconductor device structure and methods of forming the same | Guanyu Luo, Shin-Yi Yang, Ming-Han Lee | 2023-03-14 |
| 11532549 | Two 2D capping layers on interconnect conductive structure to increase interconnect structure reliability | Yu-Chen Chan, Shin-Yi Yang, Ming-Han Lee | 2022-12-20 |