Issued Patents All Time
Showing 1–25 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300549 | Gate stack treatment | Chandrashekhar Prakash Savant, Chia-Ming Tsai, Ming-Te Chen, Zack Chong, Tien-Wei Yu | 2025-05-13 |
| 12079414 | Method for driving touch panel and related touch control circuit | Tsen-Wei Chang, Wing-Kai Tang | 2024-09-03 |
| 11670553 | Gate stack treatment | Chandrashekhar Prakash Savant, Chia-Ming Tsai, Ming-Te Chen, Zack Chong, Tien-Wei Yu | 2023-06-06 |
| 11358252 | Method of using a polishing system | Kun-Tai Wu, You-Hua Chou, Chih-Tsung Lee, Min Hao Hong, Chih-Jen Wu +4 more | 2022-06-14 |
| 11088029 | Gate stack treatment | Chandrashekhar Prakash Savant, Chia-Ming Tsai, Ming-Te Chen, Zack Chong, Tien-Wei Yu | 2021-08-10 |
| 10840105 | Gate structure with insulating structure and method for manufacturing the same | Yu-Hung Lin, Hon-Lin Huang, Rueijer Lin, Sheng-Hsuan Lin | 2020-11-17 |
| 10357867 | Polishing system | Kun-Tai Wu, You-Hua Chou, Chih-Tsung Lee, Min Hao Hong, Chih-Jen Wu +4 more | 2019-07-23 |
| 9966304 | Method for forming interconnect structure | Yu-Hung Lin, Ching-Fu Yeh, Hsin-Chen Tsai, Yao-Hsiang Liang, Yu-Min Chang | 2018-05-08 |
| 9718164 | Polishing system and polishing method | Kun-Tai Wu, You-Hua Chou, Chih-Tsung Lee, Min Hao Hong, Chih-Jen Wu +4 more | 2017-08-01 |
| 9601593 | Semiconductor device structure and method for forming the same | Ke-Chih Liu, Chia-Ming Tsai | 2017-03-21 |
| 9589892 | Interconnect structure and method of forming the same | Yu-Hung Lin, Mei-Hui Fu, Wei-Jung Lin, You-Hua Chou, Chia-Lin Hsu +1 more | 2017-03-07 |
| 9385080 | Interconnect structure and method of forming the same | Yu-Hung Lin, Mei-Hui Fu, Wei-Jung Lin, You-Hua Chou, Chia-Lin Hsu +1 more | 2016-07-05 |
| 9287153 | Semiconductor baking apparatus and operation method thereof | Hsin-Kai Chen, Hung-Chih Wang, Hon-Lin Huang | 2016-03-15 |
| 7851358 | Low temperature method for minimizing copper hillock defects | Jun Wu, Wen-Long Lee, Chyi-Tsong Ni | 2010-12-14 |
| 7635651 | Method of smoothening dielectric layer | Wen-Long Lee, Jun Wu, Chyi-Tsong Ni | 2009-12-22 |
| 7611589 | Methods of spin-on wafer cleaning | Jun Wu, Dong Lu, Wen-Long Lee, Yi-An Jian, Guang-Cheng Wang +4 more | 2009-11-03 |
| 7368383 | Hillock reduction in copper films | Francis Wang, Wen-Long Lee, Sez-An Wu | 2008-05-06 |
| 7274353 | Capacitive touchpad integrated with key and handwriting functions | Yen-Chang Chiu, Ting-Hao Yeh, Yung-Lieh Chien | 2007-09-25 |
| 7183199 | Method of reducing the pattern effect in the CMP process | Chi-Wen Liu, Jung-Chih Tsao, Shien-Ping Feng, Kei-Wei Chen, Ray Chuang | 2007-02-27 |
| 7125802 | CMP process leaving no residual oxide layer or slurry particles | Ying-Lang Wang, Yi-Lung Cheng, Chi-Wen Liu, Ming-Hua Yoo, Wen-Kung Cheng +1 more | 2006-10-24 |
| 6949448 | Local oxidation of silicon (LOCOS) method employing graded oxidation mask | — | 2005-09-27 |
| 6903019 | CMP process leaving no residual oxide layer or slurry particles | Ying-Lang Wang, Yi-Lung Cheng, Chi-Wen Liu, Ming-Hua Yoo, Wen-Kung Cheng +1 more | 2005-06-07 |
| 6815007 | Method to solve IMD-FSG particle and increase Cp yield by using a new tougher UFUN season film | Ming-Hwa Yoo, Yi-Lung Cheng, Szu-An Wu, Ying-Lang Wang | 2004-11-09 |
| 6784077 | Shallow trench isolation process | Chih-Chung Lee, Guey Bao Huang, Szu-An Wu, Ying-Lang Wang, Chun-Chun Yeh | 2004-08-31 |
| 6660638 | CMP process leaving no residual oxide layer or slurry particles | Ying-Lang Wang, Yi-Lung Cheng, Chi-Wen Liu, Ming-Hua Yoo, Wen-Kung Cheng +1 more | 2003-12-09 |