Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7667835 | Apparatus and method for preventing copper peeling in ECP | Hsi-Kuei Cheng, Jung-Chih Tsao, Hsien-Ping Feng, Ming-Yuan Cheng, Steven Lin | 2010-02-23 |
| 7432192 | Post ECP multi-step anneal/H2 treatment to reduce film impurity | Hsien-Ping Feng, Jung-Chih Tsao, Hsi-Kuei Cheng, Chih-Tsung Lee, Ming-Yuan Cheng +2 more | 2008-10-07 |
| 7208404 | Method to reduce Rs pattern dependence effect | Jung-Chih Tsao, Chi-Wen Li, Kei-Wei Chen, Jye-Wei Hsu, Hsien-Pin Fong +1 more | 2007-04-24 |
| 7183199 | Method of reducing the pattern effect in the CMP process | Chi-Wen Liu, Jung-Chih Tsao, Shien-Ping Feng, Kei-Wei Chen, Shih-Chi Lin | 2007-02-27 |
| 7102871 | Electrostatic chuck assembly having disassembling device | Cheng-Liang Chang, Jen Wei, Chian-Kuo Huang, Huan-Wen Lai, Ching-Sun Lee +4 more | 2006-09-05 |
| 7030016 | Post ECP multi-step anneal/H2 treatment to reduce film impurity | Hsien-Ping Feng, Jung-Chih Tsao, Hsi-Kuei Cheng, Chih-Tsung Lee, Ming-Yuan Cheng +2 more | 2006-04-18 |
| 4649609 | Apparatus and process for providing an alternate coolant path in the core of a nuclear reactor | Ricardo A. Allison, John B. Gunter, Clifford J. Winkler, Diane E. Falk | 1987-03-17 |