Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7667835 | Apparatus and method for preventing copper peeling in ECP | Hsi-Kuei Cheng, Jung-Chih Tsao, Hsien-Ping Feng, Ming-Yuan Cheng, Ray Chuang | 2010-02-23 |
| 7481910 | Method and apparatus for stabilizing plating film impurities | Hsien-Ping Feng, Ming-Yuang Cheng, Si Cheng, Jung-Chih Tsao, Chen-Peng Fan +1 more | 2009-01-27 |
| 7432192 | Post ECP multi-step anneal/H2 treatment to reduce film impurity | Hsien-Ping Feng, Jung-Chih Tsao, Hsi-Kuei Cheng, Chih-Tsung Lee, Ming-Yuan Cheng +2 more | 2008-10-07 |
| 7262067 | Method for conductive film quality evaluation | Hsien-Ping Feng, Min-Yuan Cheng, Hsi-Kuei Cheng, Huang-Yi Huang, Yuh-Da Fan | 2007-08-28 |
| 7256120 | Method to eliminate plating copper defect | Jung-Chin Tsao, Chi-Wen Liu, Hsien-Ping Feng, Hsi-Kuei Cheng, Min-Yuan Cheng | 2007-08-14 |
| 7253093 | Method for fabricating interconnection in an insulating layer on a wafer | Su-Ping Chiu | 2007-08-07 |
| 7208404 | Method to reduce Rs pattern dependence effect | Jung-Chih Tsao, Chi-Wen Li, Kei-Wei Chen, Jye-Wei Hsu, Hsien-Pin Fong +1 more | 2007-04-24 |
| 7122471 | Method for preventing voids in metal interconnects | Jung-Chih Tsao, Chi-Wen Liu, Si-Kua Cheng, Che-Tsao Wang, Hsien-Ping Feng +1 more | 2006-10-17 |
| 7030016 | Post ECP multi-step anneal/H2 treatment to reduce film impurity | Hsien-Ping Feng, Jung-Chih Tsao, Hsi-Kuei Cheng, Chih-Tsung Lee, Ming-Yuan Cheng +2 more | 2006-04-18 |