Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532503 | Conductive feature structure including a blocking region | Pin-Wen Chen, Chia-Han Lai, Min-Hsiu Hung, Ya-Yi Cheng | 2022-12-20 |
| 11482495 | Semiconductor arrangement and method for making | Pin-Wen Chen, Hong-Mao Lee, Wei-Jung Lin, Chih-Wei Chang | 2022-10-25 |
| 10943823 | Conductive feature formation and structure using bottom-up filling deposition | Pin-Wen Chen, Chia-Han Lai, Chih-Wei Chang, Ming-Hsing Tsai, Wei-Jung Lin +3 more | 2021-03-09 |
| 10847411 | Conductive feature formation and structure | Pin-Wen Chen, Chia-Han Lai, Min-Hsiu Hung, Ya-Yi Cheng | 2020-11-24 |
| 10804140 | Interconnect formation and structure | Pin-Wen Chen, Chia-Han Lai, Min-Hsiu Hung, Ya-Yi Cheng | 2020-10-13 |
| 10756017 | Contact structure and method of forming | Yu-Hung Lin, Sheng-Hsuan Lin | 2020-08-25 |
| 10475702 | Conductive feature formation and structure using bottom-up filling deposition | Pin-Wen Chen, Chia-Han Lai, Chih-Wei Chang, Ming-Hsing Tsai, Wei-Jung Lin +3 more | 2019-11-12 |
| 10269713 | Contact structure and method of forming | Yu-Hung Lin, Sheng-Hsuan Lin | 2019-04-23 |
| 9831183 | Contact structure and method of forming | Yu-Hung Lin, Sheng-Hsuan Lin | 2017-11-28 |
| 9589892 | Interconnect structure and method of forming the same | Yu-Hung Lin, Wei-Jung Lin, You-Hua Chou, Chia-Lin Hsu, Hon-Lin Huang +1 more | 2017-03-07 |
| 9385080 | Interconnect structure and method of forming the same | Yu-Hung Lin, Wei-Jung Lin, You-Hua Chou, Chia-Lin Hsu, Hon-Lin Huang +1 more | 2016-07-05 |