Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417945 | Contact features of semiconductor device and method of forming same | Pei Shan Chang, Yi-Hsiang Chao, Chun-Hsien Huang, Peng-Hao Hsu, Kevin Lee +5 more | 2025-09-16 |
| 12328890 | Contact with a silicide region | Yu-Wen Cheng, Cheng-Tung Lin, Chih-Wei Chang, Hong-Mao Lee, Ming-Hsing Tsai +6 more | 2025-06-10 |
| 12308292 | Methods of forming semiconductor device structures | Yu-Chen Ko, Kai-Chieh Yang, Yu-Ting Wen, Min-Hsiu Hung, Wei-Jung Lin +2 more | 2025-05-20 |
| 12272600 | Contact features of semiconductor device and method of forming same | Pin-Wen Chen, Chang-Ting Chung, Yi-Hsiang Chao, Yu-Ting Wen, Kai-Chieh Yang +7 more | 2025-04-08 |
| 12237218 | Method of fabricating contact structure | Chang-Ting Chung, Shih-Wei Yeh, Kai-Chieh Yang, Yu-Ting Wen, Yu-Chen Ko +5 more | 2025-02-25 |
| 11532503 | Conductive feature structure including a blocking region | Pin-Wen Chen, Chia-Han Lai, Mei-Hui Fu, Min-Hsiu Hung | 2022-12-20 |
| 11411094 | Contact with a silicide region | Yu-Wen Cheng, Cheng-Tung Lin, Chih-Wei Chang, Hong-Mao Lee, Ming-Hsing Tsai +6 more | 2022-08-09 |
| 10943823 | Conductive feature formation and structure using bottom-up filling deposition | Pin-Wen Chen, Chia-Han Lai, Chih-Wei Chang, Mei-Hui Fu, Ming-Hsing Tsai +3 more | 2021-03-09 |
| 10847411 | Conductive feature formation and structure | Pin-Wen Chen, Chia-Han Lai, Mei-Hui Fu, Min-Hsiu Hung | 2020-11-24 |
| 10804140 | Interconnect formation and structure | Pin-Wen Chen, Chia-Han Lai, Mei-Hui Fu, Min-Hsiu Hung | 2020-10-13 |
| 10535748 | Method of forming a contact with a silicide region | Yu-Wen Cheng, Cheng-Tung Lin, Chih-Wei Chang, Hong-Mao Lee, Ming-Hsing Tsai +6 more | 2020-01-14 |
| 10475702 | Conductive feature formation and structure using bottom-up filling deposition | Pin-Wen Chen, Chia-Han Lai, Chih-Wei Chang, Mei-Hui Fu, Ming-Hsing Tsai +3 more | 2019-11-12 |