Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362198 | Interface tool and methods of operation | Yu-Syuan Cai, Chen-Yuan Kao, Hong-Ming Wu, Yu-Chan Tsai, Chun-Hsien Huang +1 more | 2025-07-15 |
| 11929314 | Interconnect structures including a fin structure and a metal cap | Chun-Hsien Huang, Peng-Fu Hsu, Yu-Syuan Cai, Min-Hsiu Hung, Chen-Yuan Kao +4 more | 2024-03-12 |
| 11532503 | Conductive feature structure including a blocking region | Pin-Wen Chen, Mei-Hui Fu, Min-Hsiu Hung, Ya-Yi Cheng | 2022-12-20 |
| 11444028 | Contact structure and formation thereof | Hong-Mao Lee, Huicheng Chang, Chi-Hsuan Ni, Cheng-Tung Lin, Huang-Yi Huang +4 more | 2022-09-13 |
| 10943823 | Conductive feature formation and structure using bottom-up filling deposition | Pin-Wen Chen, Chih-Wei Chang, Mei-Hui Fu, Ming-Hsing Tsai, Wei-Jung Lin +3 more | 2021-03-09 |
| 10847411 | Conductive feature formation and structure | Pin-Wen Chen, Mei-Hui Fu, Min-Hsiu Hung, Ya-Yi Cheng | 2020-11-24 |
| 10804140 | Interconnect formation and structure | Pin-Wen Chen, Mei-Hui Fu, Min-Hsiu Hung, Ya-Yi Cheng | 2020-10-13 |
| 10510664 | Contact structure and formation thereof | Hong-Mao Lee, Huicheng Chang, Chi-Hsuan Ni, Cheng-Tung Lin, Huang-Yi Huang +4 more | 2019-12-17 |
| 10475702 | Conductive feature formation and structure using bottom-up filling deposition | Pin-Wen Chen, Chih-Wei Chang, Mei-Hui Fu, Ming-Hsing Tsai, Wei-Jung Lin +3 more | 2019-11-12 |
| 9978583 | Opening fill process and structures formed thereby | Chun-I Tsai, Chi-Yuan Chen, Wei-Jung Lin | 2018-05-22 |
| 9735107 | Contact structure and formation thereof | Hong-Mao Lee, Huicheng Chang, Chi-Hsuan Ni, Cheng-Tung Lin, Huang-Yi Huang +4 more | 2017-08-15 |
| 9653594 | Semiconductor device and method for forming the same | Wen-Chi Tsai, Yung-Chung Chen, Mei-Yun Wang, Chii-Ming Wu, Fang Chen +2 more | 2017-05-16 |
| 9627313 | Opening fill process and structure formed thereby | Chun-I Tsai, Chi-Yuan Chen, Wei-Jung Lin | 2017-04-18 |
| 9449922 | Contact critical dimension control | Tain-Shang Chang, Ren-Hau Yu, Ching-Yao Sun, Yu-Sheng Wang | 2016-09-20 |
| 9299607 | Contact critical dimension control | Tain-Shang Chang, Ren-Hau Yu, Ching-Yao Sun, Yu-Sheng Wang | 2016-03-29 |
| 9287170 | Contact structure and formation thereof | Hong-Mao Lee, Teng-Chun Tsai, Li-Ting Wang, Chi-Yuan Chen, Cheng-Tung Lin +4 more | 2016-03-15 |
| 9252019 | Semiconductor device and method for forming the same | Wen-Chi Tsai, Yung-Chung Chen, Mei-Yun Wang, Chii-Ming Wu, Fang Chen +2 more | 2016-02-02 |
| 9245797 | Opening fill process and structure formed thereby | Chun-I Tsai, Chi-Yuan Chen, Wei-Jung Lin | 2016-01-26 |
| 9219009 | Method of integrated circuit fabrication | Chun-I Tsai, Wei-Jung Lin | 2015-12-22 |
| 8927418 | Systems and methods for reducing contact resistivity of semiconductor devices | Cheng-Tung Lin, Teng-Chun Tsai, Li-Ting Wang, Chi-Yuan Chen, Hong-Mao Lee +3 more | 2015-01-06 |