Issued Patents All Time
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394094 | Extrinsic calibration parameter generating device, method, and non-transitory computer readable storage medium thereof | Wei-Fan Chen | 2025-08-19 |
| 12388194 | Antenna-in-module package-on-package with air trenches | Ya-Jui Hsieh, Shih-Chao Chiu, Yao-Pang Hsu | 2025-08-12 |
| D1068881 | Embellishing plate of cutting tool | — | 2025-04-01 |
| 12080614 | Lidded semiconductor package | Shih-Chao Chiu, Wen-Sung Hsu, Ya-Jui Hsieh, Yao-Pang Hsu, Wen-Chun Huang | 2024-09-03 |
| D1039356 | Handle of a cutting tool | — | 2024-08-20 |
| 11967570 | Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure | Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu +1 more | 2024-04-23 |
| 11705413 | Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure | Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu +1 more | 2023-07-18 |
| 11471585 | Negative pressure wound therapy device, system and method | Po-Han Chang, Shih Hua Hsiao, Bo-Cheng Huang, Ting Hsuan Chung | 2022-10-18 |
| 11444028 | Contact structure and formation thereof | Hong-Mao Lee, Huicheng Chang, Chia-Han Lai, Chi-Hsuan Ni, Cheng-Tung Lin +4 more | 2022-09-13 |
| 11302657 | Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure | Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu +1 more | 2022-04-12 |
| 11227846 | Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure | Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu +1 more | 2022-01-18 |
| 10756040 | Semiconductor package with rigid under bump metallurgy (UBM) stack | Ta-Jen Yu, Wen-Sung Hsu | 2020-08-25 |
| 10549017 | Suction disc | Shih Hua Hsiao, Bo-Cheng Huang | 2020-02-04 |
| 10510664 | Contact structure and formation thereof | Hong-Mao Lee, Huicheng Chang, Chia-Han Lai, Chi-Hsuan Ni, Cheng-Tung Lin +4 more | 2019-12-17 |
| 10283359 | Systems and methods for gap filling improvement | Li-Ting Wang, Teng-Chun Tsai, Chun-I Tsai, Wei-Jung Lin, Huang-Yi Huang +2 more | 2019-05-07 |
| 10157995 | Integrating junction formation of transistors with contact formation | Li-Ting Wang, Teng-Chun Tsai, Chun-Hsiung Lin, Cheng-Tung Lin, Hong-Mao Lee +1 more | 2018-12-18 |
| 9978583 | Opening fill process and structures formed thereby | Chun-I Tsai, Wei-Jung Lin, Chia-Han Lai | 2018-05-22 |
| 9856480 | Dnazyme for silencing the expression of EGFR | Pan-Chyr Yang, Wei-Yun Lai, Konan Peck, Cheng-Ju Chang, Shuenn-Chen Yang | 2018-01-02 |
| 9735107 | Contact structure and formation thereof | Hong-Mao Lee, Huicheng Chang, Chia-Han Lai, Chi-Hsuan Ni, Cheng-Tung Lin +4 more | 2017-08-15 |
| 9624576 | Systems and methods for gap filling improvement | Li-Ting Wang, Teng-Chun Tsai, Chun-I Tsai, Wei-Jung Lin, Huang-Yi Huang +2 more | 2017-04-18 |
| 9627313 | Opening fill process and structure formed thereby | Chun-I Tsai, Wei-Jung Lin, Chia-Han Lai | 2017-04-18 |
| 9508716 | Methods of manufacturing a semiconductor device | Cheng-Tung Lin, Teng-Chun Tsai, Li-Ting Wang, Kuo-Yin Lin, Wan-Chun Pan +5 more | 2016-11-29 |
| 9287170 | Contact structure and formation thereof | Hong-Mao Lee, Teng-Chun Tsai, Li-Ting Wang, Cheng-Tung Lin, Chi-Hsuan Ni +4 more | 2016-03-15 |
| 9245797 | Opening fill process and structure formed thereby | Chun-I Tsai, Wei-Jung Lin, Chia-Han Lai | 2016-01-26 |
| 9153657 | Semiconductor devices comprising a fin | Teng-Chun Tsai, Kuo-Yin Lin, Wan-Chun Pan, Hsiang-Pi Chang, Shi Ning Ju +3 more | 2015-10-06 |