Issued Patents All Time
Showing 25 most recent of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854784 | Chip scale package structure and method of forming the same | Yen-Yao Chi, Nai-Wei Liu, Tzu-Hung Lin, Wen-Sung Hsu, Shih-Chin Lin | 2023-12-26 |
| 11791266 | Chip scale package structure and method of forming the same | Yen-Yao Chi, Nai-Wei Liu, Tzu-Hung Lin, Wen-Sung Hsu | 2023-10-17 |
| 11469201 | Semiconductor package and method for fabricating base for semiconductor package | Tzu-Hung Lin, Wen-Sung Hsu, Andrew C. Chang | 2022-10-11 |
| 11450606 | Chip scale package structure and method of forming the same | Yen-Yao Chi, Nai-Wei Liu, Tzu-Hung Lin, Wen-Sung Hsu | 2022-09-20 |
| 10916449 | Semiconductor package and method for fabricating base for semiconductor package | Wen-Sung Hsu | 2021-02-09 |
| 10756040 | Semiconductor package with rigid under bump metallurgy (UBM) stack | Chi-Yuan Chen, Wen-Sung Hsu | 2020-08-25 |
| 10580747 | Semiconductor package and method for fabricating base for semiconductor package | Tzu-Hung Lin, Wen-Sung Hsu, Andrew C. Chang | 2020-03-03 |
| 10573536 | Semiconductor package and method for fabricating base for semiconductor package | Wen-Sung Hsu | 2020-02-25 |
| 10573615 | Semiconductor package and method for fabricating base for semiconductor package | Tzu-Hung Lin, Wen-Sung Hsu, Andrew C. Chang | 2020-02-25 |
| 10573616 | Semiconductor package and method for fabricating base for semiconductor package | Tzu-Hung Lin, Wen-Sung Hsu, Andrew C. Chang | 2020-02-25 |
| 10553526 | Semiconductor package | Wen-Sung Hsu, Tzu-Hung Lin | 2020-02-04 |
| 10340198 | Semiconductor package with embedded supporter and method for fabricating the same | Wen-Sung Hsu | 2019-07-02 |
| 10312210 | Semiconductor package | Ching-Liou Huang | 2019-06-04 |
| 10236187 | Semiconductor package and method for fabricating base for semiconductor package | Wen-Sung Hsu | 2019-03-19 |
| 10236242 | Chip package and package substrate | Wen-Sung Hsu | 2019-03-19 |
| 10217716 | Semiconductor package and method for fabricating the same | Yu-Sheng Hung, Wen-Sung Hsu | 2019-02-26 |
| 10115604 | Semiconductor package and method for fabricating base for semiconductor package | Wen-Sung Hsu | 2018-10-30 |
| 10074581 | Chip package having a patterned conducting plate and a conducting pad with a recess | Wen-Sung Hsu, Ming-Chieh Lin | 2018-09-11 |
| 9972593 | Semiconductor package | Ching-Liou Huang | 2018-05-15 |
| 9922844 | Semiconductor package and method for fabricating base for semiconductor package | Wen-Sung Hsu | 2018-03-20 |
| 9852973 | Manufacturing method of chip package and package substrate | Wen-Sung Hsu | 2017-12-26 |
| 9633936 | Semiconductor package | Wen-Sung Hsu, Tzu-Hung Lin | 2017-04-25 |
| 9627311 | Chip package, package substrate and manufacturing method thereof | Wen-Sung Hsu | 2017-04-18 |
| 9553040 | Semiconductor package | Wen-Sung Hsu, Tzu-Hung Lin | 2017-01-24 |
| 9520349 | Semiconductor package | Wen-Sung Hsu, Tzu-Hung Lin | 2016-12-13 |