Issued Patents All Time
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9437457 | Chip package having a patterned conducting plate and method for forming the same | Wen-Sung Hsu, Ming-Chieh Lin | 2016-09-06 |
| 9373526 | Chip package and method for forming the same | Wen-Sung Hsu, Ming-Chieh Lin | 2016-06-21 |
| 9177899 | Semiconductor package and method for fabricating base for semiconductor package | Tzu-Hung Lin, Wen-Sung Hsu, Andrew C. Chang | 2015-11-03 |
| 8048778 | Methods of dicing a semiconductor structure | Chin-Yu Ku, Hsiu-Mei Yu, Chun-Ying Lin, Young-Chang Lien, Sheng-Hsiang Chiu | 2011-11-01 |