| D1024932 |
Connector plug |
Ko-Ming Chen, Shih-Hsiang WANG, An-Hung Lin, Min-Chuan Wu, Shao-Pei Lin +1 more |
2024-04-30 |
|
| 10535593 |
Package structure having a plurality of conductive balls with narrow width for ball waist |
Pi-Lan Chang, Chen-Shien Chen, Chin-Yu Ku, Hsu-Hsien Chen, Wei-Chih Huang +1 more |
2020-01-14 |
$2,940,000 |
| 10276481 |
Package structure having a plurality of conductive balls having narrow width for the ball waist |
Pi-Lan Chang, Chen-Shien Chen, Chin-Yu Ku, Hsu-Hsien Chen, Wei-Chih Huang +1 more |
2019-04-30 |
$1,428,000 |
| 9328930 |
Range hood with an easily assembled and disassembled lamp |
— |
2016-05-03 |
|
| 8105876 |
Leadframe for leadless package, structure and manufacturing method using the same |
Geng-Shin Shen, Yu-Tang Pan, Shih-Wen Chou |
2012-01-31 |
$913,000 |
| 8106494 |
Leadframe for leadless package, structure and manufacturing method using the same |
Geng-Shin Shen, Yu-Tang Pan, Shih-Wen Chou |
2012-01-31 |
$913,000 |
| 8048778 |
Methods of dicing a semiconductor structure |
Chin-Yu Ku, Hsiu-Mei Yu, Young-Chang Lien, Sheng-Hsiang Chiu, Ta-Jen Yu |
2011-11-01 |
$2,910,000 |
| 7932531 |
Chip package |
Ya-Chi Chen, Yu-Ren Chen, I-Hsin Mao |
2011-04-26 |
$3,685,000 |
| 7902649 |
Leadframe for leadless package, structure and manufacturing method using the same |
Geng-Shin Shen, Yu-Tang Pan, Shih-Wen Chou |
2011-03-08 |
$3,659,000 |
| 7851262 |
Manufacturing process for a chip package structure |
Geng-Shin Shen |
2010-12-14 |
$1,017,000 |
| 7851896 |
Quad flat non-leaded chip package |
Geng-Shin Shen, Shih-Wen Chou |
2010-12-14 |
$1,017,000 |
| 7851270 |
Manufacturing process for a chip package structure |
Geng-Shin Shen |
2010-12-14 |
$1,017,000 |
| 7842550 |
Method of fabricating quad flat non-leaded package |
Geng-Shin Shen, Po-Kai Hou |
2010-11-30 |
$1,428,000 |
| 7803666 |
Manufacturing process for a Quad Flat Non-leaded chip package structure |
Geng-Shin Shen |
2010-09-28 |
$1,284,000 |
| 7803667 |
Manufacturing process for a quad flat non-leaded chip package structure |
Geng-Shin Shen |
2010-09-28 |
$1,284,000 |
| 7795079 |
Manufacturing process for a quad flat non-leaded chip package structure |
Geng-Shin Shen |
2010-09-14 |
$1,808,000 |
| 7790514 |
Manufacturing process for a chip package structure |
Geng-Shin Shen |
2010-09-07 |
$1,813,000 |
| 7696629 |
Chip-stacked package structure |
Yu-Tang Pan, Shih-Wen Chou, Geng-Shin Shen |
2010-04-13 |
|
| 7642137 |
Manufacturing method of chip package |
Ya-Chi Chen, Yu-Ren Chen, I-Hsin Mao |
2010-01-05 |
$683,000 |
| 7514106 |
Compositions and methods for uterine relaxing |
Chia-Li Wei, Meng-Hwan Lee, Jay Hua, Ying-Chieh Tsai |
2009-04-07 |
|
| 7446400 |
Chip package structure and fabricating method thereof |
Ya-Chi Chen, Yu-Ren Chen, I-Hsin Mao |
2008-11-04 |
$316,000 |
| 6961302 |
Method and structure for intensifying track seeking signals from an optical disk |
Shyh-yeu Wang, Biing-Hwang Lin |
2005-11-01 |
|
| 6732730 |
Adjustable smoke inlet set for kitchen ventilator |
— |
2004-05-11 |
|
