YP

Yu-Tang Pan

CT Chipmos Technologies: 18 patents #4 of 99Top 5%
C( Chipmos Technologies (Bermuda): 5 patents #14 of 49Top 30%
Overall (All Time): #223,455 of 4,157,543Top 6%
20
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9735092 Manufacturing method of chip package structure Shih-Wen Chou 2017-08-15
9437529 Chip package structure and manufacturing method thereof Shih-Wen Chou 2016-09-06
8772089 Chip package structure and manufacturing method thereof Shih-Wen Chou 2014-07-08
8691630 Semiconductor package structure and manufacturing method thereof Shih-Wen Chou 2014-04-08
8652882 Chip package structure and chip packaging method Shih-Wen Chou 2014-02-18
8148827 Quad flat no lead (QFN) package Shih-Wen Chou 2012-04-03
8105876 Leadframe for leadless package, structure and manufacturing method using the same Chun-Ying Lin, Geng-Shin Shen, Shih-Wen Chou 2012-01-31
8106494 Leadframe for leadless package, structure and manufacturing method using the same Chun-Ying Lin, Geng-Shin Shen, Shih-Wen Chou 2012-01-31
7919874 Chip package without core and stacked chip package structure Cheng-Ting Wu, Shih-Wen Chou, Hui Liu 2011-04-05
7902649 Leadframe for leadless package, structure and manufacturing method using the same Chun-Ying Lin, Geng-Shin Shen, Shih-Wen Chou 2011-03-08
7884486 Chip-stacked package structure and method for manufacturing the same Shih-Wen Chou 2011-02-08
7723853 Chip package without core and stacked chip package structure Cheng-Ting Wu, Shih-Wen Chou, Hui Liu 2010-05-25
7696629 Chip-stacked package structure Chun-Ying Lin, Shih-Wen Chou, Geng-Shin Shen 2010-04-13
7605461 Chip package structure Shih-Wen Chou 2009-10-20
7592694 Chip package and method of manufacturing the same Men-Shew Liu, Shih-Wen Chou 2009-09-22
7560306 Manufacturing process for chip package without core Geng-Shin Shen, Chun-Hung Lin 2009-07-14
7514299 Chip package structure and manufacturing method thereof Chun-Hung Lin, Shih-Wen Chou 2009-04-07
7510889 Light emitting chip package and manufacturing method thereof Shih-Wen Chou, Men-Shew Liu 2009-03-31
7459783 Light emitting chip package and light source module Men-Shew Liu 2008-12-02
7436074 Chip package without core and stacked chip package structure thereof Cheng-Ting Wu, Shih-Wen Chou, Hui Liu 2008-10-14