Issued Patents All Time
Showing 1–25 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9307676 | Thermally enhanced electronic package | Tzu-Hsin Huang, Yu-Ting Yang, Hung-Hsin Liu, An-Hong Liu, David W. Wang +1 more | 2016-04-05 |
| 9159685 | Conductive structure and method for forming the same | Chung-Pang Chi | 2015-10-13 |
| 9023727 | Method of manufacturing semiconductor packaging | — | 2015-05-05 |
| 8962395 | QFN package and manufacturing process thereof | — | 2015-02-24 |
| 8872336 | Conductive structure and method for forming the same | Chung-Pang Chi | 2014-10-28 |
| 8809088 | Structure of stacking chips and method for manufacturing the same | Ya-Chi Chen, I-Hsin Mao | 2014-08-19 |
| 8786082 | Semiconductor structure having no adjacent bumps between two adjacent pads | — | 2014-07-22 |
| 8736060 | Packaging structure | Jun Wang | 2014-05-27 |
| 8712932 | Computer implemented apparatus for generating and filtering creative proposal | Hui-Chung Che | 2014-04-29 |
| 8564954 | Thermally enhanced electronic package | Tzu-Hsin Huang, Yu-Ting Yang, Hung-Hsin Liu, An-Hong Liu, Wei David Wang +1 more | 2013-10-22 |
| 8431437 | Packaging method involving rearrangement of dice | Yu-Ren Chen, Tz-Cheng Chiu | 2013-04-30 |
| 8431478 | Solder cap bump in semiconductor package and method of manufacturing the same | — | 2013-04-30 |
| 8426245 | Packaging method involving rearrangement of dice | Yu-Ren Chen, Tz-Cheng Chiu | 2013-04-23 |
| 8426255 | Chip package structure and method for manufacturing the same | — | 2013-04-23 |
| 8245193 | Automatic creative proposal generating and filtering system and manufacturing method thereof and multiple components combining method | Chun-Fang Cheng, Hui-Chung Che, Hou-Bai Lee | 2012-08-14 |
| 8212347 | Stacked chip package structure with leadframe having bus bar | Wu-Chang Tu | 2012-07-03 |
| 8207603 | Stacked chip package structure with leadframe having inner leads with transfer pad | Wu-Chang Tu | 2012-06-26 |
| 8169061 | Stacked chip package structure with leadframe having bus bar | Wu-Chang Tu | 2012-05-01 |
| 8105876 | Leadframe for leadless package, structure and manufacturing method using the same | Chun-Ying Lin, Yu-Tang Pan, Shih-Wen Chou | 2012-01-31 |
| 8106494 | Leadframe for leadless package, structure and manufacturing method using the same | Chun-Ying Lin, Yu-Tang Pan, Shih-Wen Chou | 2012-01-31 |
| 8093106 | Method for manufacturing packaging structure | Jun Wang | 2012-01-10 |
| 8058109 | Method for manufacturing a semiconductor structure | — | 2011-11-15 |
| 7981725 | Fabricating process of a chip package structure | David W. Wang | 2011-07-19 |
| 7964940 | Chip package with asymmetric molding | — | 2011-06-21 |
| 7960214 | Chip package | David W. Wang | 2011-06-14 |