Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8212347 | Stacked chip package structure with leadframe having bus bar | Geng-Shin Shen | 2012-07-03 |
| 8207603 | Stacked chip package structure with leadframe having inner leads with transfer pad | Geng-Shin Shen | 2012-06-26 |
| 8169061 | Stacked chip package structure with leadframe having bus bar | Geng-Shin Shen | 2012-05-01 |
| 8026615 | IC package reducing wiring layers on substrate and its carrier | Hung-Tsun Lin, Cheng-Ting Wu | 2011-09-27 |
| 7834432 | Chip package having asymmetric molding | Geng-Shin Shen | 2010-11-16 |
| 7816771 | Stacked chip package structure with leadframe having inner leads with transfer pad | Geng-Shin Shen | 2010-10-19 |
| 7786595 | Stacked chip package structure with leadframe having bus bar | Geng-Shin Shen | 2010-08-31 |
| 7781898 | IC package reducing wiring layers on substrate and its chip carrier | Hung-Tsun Lin, Cheng-Ting Wu | 2010-08-24 |
| 7615853 | Chip-stacked package structure having leadframe with multi-piece bus bar | Geng-Shin Shen | 2009-11-10 |
| 7576416 | Chip package having with asymmetric molding and turbulent plate downset design | Geng-Shin Shen | 2009-08-18 |
| 7554197 | High frequency IC package and method for fabricating the same | Hsiang-Ming Huang, An-Hong Liu, Yeong-Jyh Lin, Yi-Chang Lee, Chun-Hung Lin +1 more | 2009-06-30 |