Issued Patents All Time
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9307676 | Thermally enhanced electronic package | Tzu-Hsin Huang, Yu-Ting Yang, Hung-Hsin Liu, Geng-Shin Shen, David W. Wang +1 more | 2016-04-05 |
| 8564954 | Thermally enhanced electronic package | Tzu-Hsin Huang, Yu-Ting Yang, Hung-Hsin Liu, Geng-Shin Shen, Wei David Wang +1 more | 2013-10-22 |
| 8550345 | RFID real-time information system accommodated to semiconductor supply chain | Cheng-Fang Huang, Pin-Hsun Huang, Chih-Hsiang Wang, Wen-Cheng Hsu, Yi Fang Cho +1 more | 2013-10-08 |
| 8338935 | Thermally enhanced electronic package utilizing carbon nanocapsules and method of manufacturing the same | David W. Wang | 2012-12-25 |
| 8269352 | Multi-chip stack package structure | David W. Wang, Hsiang-Ming Huang, Jar-Dar Yang, Yi-Chang Lee | 2012-09-18 |
| 8269351 | Multi-chip stack package structure | David W. Wang, Hsiang-Ming Huang, Jar-Dar Yang, Yi-Chang Lee | 2012-09-18 |
| 8264068 | Multi-chip stack package structure | David W. Wang, Hsiang-Ming Huang, Jar-Dar Yang, Yi-Chang Lee | 2012-09-11 |
| 7973310 | Semiconductor package structure and method for manufacturing the same | David W. Wang, Hao-Yin Tsai, Hsiang-Ming Huang, Yi-Chang Lee, Shu-Ching Ho | 2011-07-05 |
| 7696443 | Electronic device with a warped spring connector | Yi-Chang Lee, Yeong-Her Wang, Yeong-Ching Chao, Yao-Jung Lee | 2010-04-13 |
| 7642639 | COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same | Hsiang-Ming Huang, Yeong-Jyh Lin, Yi-Chang Lee | 2010-01-05 |
| 7554197 | High frequency IC package and method for fabricating the same | Hsiang-Ming Huang, Yeong-Jyh Lin, Yi-Chang Lee, Wu-Chang Tu, Chun-Hung Lin +1 more | 2009-06-30 |
| 7477065 | Method for fabricating a plurality of elastic probes in a row | Yi-Chang Lee, Yeong-Her Wang, Yeong-Ching Chao, Hsiang-Ming Huang | 2009-01-13 |
| 7420267 | Image sensor assembly and method for fabricating the same | Yeong-Ching Chao, Yao-Jung Lee | 2008-09-02 |
| 7372286 | Modular probe card | Yi-Chang Lee, Hsiang-Ming Huang, Yao-Jung Lee, Yeong-Her Wang | 2008-05-13 |
| 7370416 | Method of manufacturing an injector plate | Jiun-Heng Wang, Yeong-Ching Chao | 2008-05-13 |
| 7372135 | Multi-chip image sensor module | Yeong-Ching Chao, Yao-Jung Lee | 2008-05-13 |
| 7368809 | Pillar grid array package | Hsiang-Ming Huang, Yeong-Ching Chao, Yi-Chang Lee | 2008-05-06 |
| 7316065 | Method for fabricating a plurality of elastic probes in a row | Yi-Chang Lee, Yeong-Her Wang, Yeong-Ching Chao, Hsiang-Ming Huang | 2008-01-08 |
| 7140101 | Method for fabricating anisotropic conductive substrate | Shih-Jye Cheng, Yeong-Her Wang, Yuan-Ping Tseng, Yao-Jung Lee | 2006-11-28 |
| 7129730 | Probe card assembly | Yeong-Her Wang, Yeong-Ching Chao, Yao-Jung Lee | 2006-10-31 |
| 7088118 | Modularized probe card for high frequency probing | Yeong-Her Wang, Yeong-Ching Chao, Yao-Jung Lee | 2006-08-08 |
| 7005054 | Method for manufacturing probes of a probe card | S. Cheng, Yeong-Her Wang, Yuan-Ping Tseng, Y. Lee | 2006-02-28 |
| 6946860 | Modularized probe head | Shih-Jye Cheng, Yeong-Her Wang, Yeong-Ching Chao, Yao-Jung Lee | 2005-09-20 |
| 6853205 | Probe card assembly | Shih-Jye Cheng, Yeong-Her Wang, Yuan-Ping Tseng, Yao-Jung Lee | 2005-02-08 |
| 6812720 | Modularized probe card with coaxial transmitters | Shih-Jye Cheng, Yeong-Her Wang, Yuan-Ping Tseng, Yao-Jung Lee | 2004-11-02 |