| 7140101 |
Method for fabricating anisotropic conductive substrate |
Shih-Jye Cheng, An-Hong Liu, Yeong-Her Wang, Yao-Jung Lee |
2006-11-28 |
| 7005054 |
Method for manufacturing probes of a probe card |
S. Cheng, An-Hong Liu, Yeong-Her Wang, Y. Lee |
2006-02-28 |
| 6853205 |
Probe card assembly |
Shih-Jye Cheng, An-Hong Liu, Yeong-Her Wang, Yao-Jung Lee |
2005-02-08 |
| 6812720 |
Modularized probe card with coaxial transmitters |
Shih-Jye Cheng, An-Hong Liu, Yeong-Her Wang, Yao-Jung Lee |
2004-11-02 |
| 6781392 |
Modularized probe card with compressible electrical connection device |
Shih-Jye Cheng, An-Hong Liu, Yeong-Her Wang, Yao-Jung Lee |
2004-08-24 |
| 6751760 |
Method and system for performing memory repair analysis |
Vincent Wang, Linck Cheng, An-Hong Liu |
2004-06-15 |
| 6686615 |
Flip-chip type semiconductor device for reducing signal skew |
S. Cheng, An-Hong Liu, Yeong-Her Wang, Y. Lee |
2004-02-03 |
| 6621710 |
Modular probe card assembly |
Shih-Jye Cheng, An-Hong Liu, Yeong-Her Wang, Yao-Jung Lee |
2003-09-16 |
| 6605480 |
Wafer level packaging for making flip-chips |
An-Hong Liu, Y. Lee |
2003-08-12 |
| 6534853 |
Semiconductor wafer designed to avoid probed marks while testing |
An-Hong Liu |
2003-03-18 |
| 6395622 |
Manufacturing process of semiconductor devices |
An-Hong Liu |
2002-05-28 |