Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12074136 | Package structure and method of manufacturing the same | Tzuan-Horng Liu, Hsien-Wei Chen, Ming-Fa Chen | 2024-08-27 |
| 11587907 | Package structure | Tzuan-Horng Liu, Hsien-Wei Chen, Ming-Fa Chen | 2023-02-21 |
| 10950576 | Package structure | Tzuan-Horng Liu, Hsien-Wei Chen, Ming-Fa Chen | 2021-03-16 |
| 10468379 | 3DIC structure and method of manufacturing the same | Tzuan-Horng Liu, Hsien-Wei Chen, Ming-Fa Chen | 2019-11-05 |
| 7651886 | Semiconductor device and manufacturing process thereof | — | 2010-01-26 |
| 7538020 | Chip packaging process | — | 2009-05-26 |
| 7405144 | Method for manufacturing probe card | — | 2008-07-29 |
| 7370416 | Method of manufacturing an injector plate | Yeong-Ching Chao, An-Hong Liu | 2008-05-13 |