Issued Patents All Time
Showing 1–25 of 100 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12418005 | Semiconductor package and manufacturing method thereof | Hao-Yi Tsai, Kris Lipu Chuang, Hsin-Yu Pan | 2025-09-16 |
| 12406965 | Package | Ming-Fa Chen, Chao-Wen Shih, Hsien-Wei Chen, Sung-Feng Yeh | 2025-09-02 |
| 12362329 | Method of fabricating semiconductor package | Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang +4 more | 2025-07-15 |
| 12362178 | Method for fabricating a chip package | Jie Chen, Hsien-Wei Chen, Ying-Ju Chen | 2025-07-15 |
| 12355008 | Methods of fabricating package structure | Ming-Fa Chen, Chao-Wen Shih, Min-Chien Hsiao, Nien-Fang Wu, Sung-Feng Yeh | 2025-07-08 |
| 12300563 | Semiconductor package and method of fabricating the same | Hao-Yi Tsai | 2025-05-13 |
| 12288752 | Semiconductor packages | Ming-Fa Chen, Nien-Fang Wu, Sung-Feng Yeh, Chao-Wen Shih | 2025-04-29 |
| 12272674 | Stacking structure, package structure and method of fabricating the same | Ming-Fa Chen, Sung-Feng Yeh, Chao-Wen Shih | 2025-04-08 |
| 12266639 | Method of fabricating semiconductor package | Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang +4 more | 2025-04-01 |
| 12224265 | Three-dimensional stacking structure and manufacturing method thereof | Ming-Fa Chen, Sung-Feng Yeh, Chao-Wen Shih | 2025-02-11 |
| 12199024 | Semiconductor device and method of manufacture | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen | 2025-01-14 |
| 12154897 | Package structures | Ming-Fa Chen, Sung-Feng Yeh, Chao-Wen Shih | 2024-11-26 |
| 12154875 | Package and method of fabricating the same | Ming-Fa Chen, Chao-Wen Shih, Jen-Li Hu | 2024-11-26 |
| 12148664 | Semiconductor device and method having a through substrate via and an interconnect structure | Ming-Fa Chen, Chao-Wen Shih | 2024-11-19 |
| 12132024 | Semiconductor package and method of manufacturing the same | Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Yuan Yu | 2024-10-29 |
| 12125821 | Package having multiple chips integrated therein and manufacturing method thereof | Ming-Fa Chen, Sung-Feng Yeh, Chao-Wen Shih | 2024-10-22 |
| 12119328 | Methods of fabricating the same die stack structure and semiconductor structure | Ming-Fa Chen, Chao-Wen Shih, Min-Chien Hsiao, Nien-Fang Wu, Sung-Feng Yeh | 2024-10-15 |
| 12094852 | Package structure and method of manufacturing the same | Ming-Fa Chen, Sung-Feng Yeh, Chao-Wen Shih | 2024-09-17 |
| 12074136 | Package structure and method of manufacturing the same | Hsien-Wei Chen, Jiun-Heng Wang, Ming-Fa Chen | 2024-08-27 |
| 12057439 | Integrated circuit packages | Ming-Fa Chen, Chao-Wen Shih, Sung-Feng Yeh, Nien-Fang Wu | 2024-08-06 |
| 12057438 | Die stack structure and manufacturing method thereof | Chen-Hua Yu, Hsien-Wei Chen, Ming-Fa Chen, Sung-Feng Yeh | 2024-08-06 |
| 12057437 | Package structure, chip structure and method of fabricating the same | Ming-Fa Chen, Sung-Feng Yeh, Chao-Wen Shih | 2024-08-06 |
| 12051673 | Package having multiple chips integrated therein and manufacturing method thereof | Ming-Fa Chen, Sung-Feng Yeh, Chao-Wen Shih | 2024-07-30 |
| 12046579 | Package having bonding layers | Ming-Fa Chen, Chao-Wen Shih, Hsien-Wei Chen, Sung-Feng Yeh | 2024-07-23 |
| 12027494 | Semiconductor device and manufacturing method thereof | Hao-Yi Tsai, Chien Ling Hwang | 2024-07-02 |