Issued Patents All Time
Showing 26–50 of 100 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12015013 | Die stack structure, semiconductor structure and method of fabricating the same | Ming-Fa Chen, Chao-Wen Shih, Min-Chien Hsiao, Nien-Fang Wu, Sung-Feng Yeh | 2024-06-18 |
| 11935871 | Semiconductor package and method of fabricating the same | Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang +4 more | 2024-03-19 |
| 11916025 | Device die and method for fabricating the same | Shih-Wei Chen, Chia-Hung Liu, Hao-Yi Tsai | 2024-02-27 |
| 11916012 | Manufacturing method of semiconductor structure | Ming-Fa Chen, Sung-Feng Yeh, Chao-Wen Shih | 2024-02-27 |
| 11908692 | Method for fabricating a chip package | Jie Chen, Hsien-Wei Chen, Ying-Ju Chen | 2024-02-20 |
| 11894309 | System on integrated chips (SoIC) and semiconductor structures with integrated SoIC | Chen-Hua Yu, Ming-Fa Chen, Chao-Wen Shih, Sung-Feng Yeh | 2024-02-06 |
| 11869819 | Integrated circuit component and package structure having the same | Chao-Hsiang Yang, Hsien-Wei Chen, Ming-Fa Chen | 2024-01-09 |
| 11854921 | Integrated circuit package and method | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen | 2023-12-26 |
| 11823980 | Package structure and manufacturing method thereof | Hao-Yi Tsai | 2023-11-21 |
| 11810897 | Package structure and method of fabricating the same | Ming-Fa Chen, Nien-Fang Wu, Sung-Feng Yeh, Chao-Wen Shih | 2023-11-07 |
| 11784163 | Stacking structure, package structure and method of fabricating the same | Ming-Fa Chen, Sung-Feng Yeh, Chao-Wen Shih | 2023-10-10 |
| 11742297 | Semiconductor packages | Ming-Fa Chen, Nien-Fang Wu, Sung-Feng Yeh, Chao-Wen Shih | 2023-08-29 |
| 11682593 | Interposer test structures and methods | Chen-Hua Yu, Hsien-Pin Hu, Tzu-Yu Wang, Wei-Cheng Wu, Shang-Yun Hou +1 more | 2023-06-20 |
| 11664315 | Structure with interconnection die and method of making same | Hao-Yi Tsai, Ting Hao Kuo | 2023-05-30 |
| 11658069 | Method for manufacturing a semiconductor device having an interconnect structure over a substrate | Ming-Fa Chen, Chao-Wen Shih | 2023-05-23 |
| 11594460 | Semiconductor package and method of fabricating the same | Hao-Yi Tsai | 2023-02-28 |
| 11587894 | Package and method of fabricating the same | Ming-Fa Chen, Chao-Wen Shih, Jen-Li Hu | 2023-02-21 |
| 11587907 | Package structure | Hsien-Wei Chen, Jiun-Heng Wang, Ming-Fa Chen | 2023-02-21 |
| 11574878 | Semiconductor structure and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen | 2023-02-07 |
| 11562983 | Package having multiple chips integrated therein and manufacturing method thereof | Ming-Fa Chen, Sung-Feng Yeh, Chao-Wen Shih | 2023-01-24 |
| 11552074 | Package structures and methods of fabricating the same | Ming-Fa Chen, Sung-Feng Yeh, Chao-Wen Shih | 2023-01-10 |
| 11502062 | Integrated circuit package and method | Ming-Fa Chen, Chao-Wen Shih, Sung-Feng Yeh, Nien-Fang Wu | 2022-11-15 |
| 11456240 | Semiconductor device and method of manufacture | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen | 2022-09-27 |
| 11450579 | Integrated circuit component and package structure having the same | Chao-Hsiang Yang, Hsien-Wei Chen, Ming-Fa Chen | 2022-09-20 |
| 11443995 | Integrated circuit package and method | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen | 2022-09-13 |