Issued Patents All Time
Showing 76–100 of 100 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090213 | Interposer test structures and methods | Chen-Hua Yu, Hsien-Pin Hu, Tzu-Yu Wang, Wei-Cheng Wu, Shang-Yun Hou +1 more | 2018-10-02 |
| 9978637 | Mechanism for forming patterned metal pad connected to multiple through silicon vias (TSVs) | Shih-Wen Huang, Chung-Yu Lu, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng | 2018-05-22 |
| 9653531 | Methods of manufacturing a package | Hsiao-Tsung Yen, Min-Chie Jeng, Hsien-Pin Hu, Chin-Wei Kuo, Chung-Yu Lu +1 more | 2017-05-16 |
| 9627223 | Methods and apparatus of packaging with interposers | Chung-Yu Lu, Hsien-Pin Hu, Hsiao-Tsung Yen, Shih-Wen Huang, Shang-Yun Hou +1 more | 2017-04-18 |
| 9589857 | Interposer test structures and methods | Chen-Hua Yu, Hsien-Pin Hu, Tzu-Yu Wang, Wei-Cheng Wu, Shang-Yun Hou +1 more | 2017-03-07 |
| 9570366 | Passivation layer for packaged chip | Shin-Puu Jeng, Wei-Cheng Wu, Shang-Yun Hou, Chen-Hua Yu, Tzu-Wei Chiu +1 more | 2017-02-14 |
| 9530730 | Configurable routing for packaging applications | Chung-Yu Lu, Hsien-Pin Hu, Shin-Puu Jeng, Shang-Yun Hou, Shih-Wen Huang +1 more | 2016-12-27 |
| 9305808 | Methods and apparatus of packaging with interposers | Chung-Yu Lu, Hsien-Pin Hu, Hsiao-Tsung Yen, Shih-Wen Huang, Shang-Yun Hou +1 more | 2016-04-05 |
| 9128123 | Interposer test structures and methods | Chen-Hua Yu, Hsien-Pin Hu, Tzu-Yu Wang, Wei-Cheng Wu, Shang-Yun Hou +1 more | 2015-09-08 |
| 9129818 | Semiconductor device having conductive pads and a method of manufacturing the same | Chen-Cheng Kuo, Chen-Shien Chen | 2015-09-08 |
| 9064705 | Methods and apparatus of packaging with interposers | Chung-Yu Lu, Hsien-Pin Hu, Hsiao-Tsung Yen, Shih-Wen Huang, Shang-Yun Hou +1 more | 2015-06-23 |
| 8963328 | Reducing delamination between an underfill and a buffer layer in a bond structure | Ching-Jung Yang, Chang-Pin Huang, Michael Shou-Ming Tong, Ying-Ju Chen, Tung-Liang Shao +3 more | 2015-02-24 |
| 8916971 | Multi-direction design for bump pad structures | Chih-Hua Chen, Chen-Shien Chen, Chen-Cheng Kuo | 2014-12-23 |
| 8896094 | Methods and apparatus for inductors and transformers in packages | Hsiao-Tsung Yen, Yu-Ling Lin, Chung-Yu Lu, Chin-Wei Kuo, Hsien-Pin Hu +1 more | 2014-11-25 |
| 8753971 | Dummy metal design for packaging structures | Shang-Yun Hou, Shin-Puu Jeng, Wei-Cheng Wu, Hsiu-Ping Wei, Chih-Hua Chen +3 more | 2014-06-17 |
| 8729700 | Multi-direction design for bump pad structures | Chih-Hua Chen, Chen-Shien Chen, Chen-Cheng Kuo | 2014-05-20 |
| 8669651 | Package-on-package structures with reduced bump bridging | Chung-Ying Yang, Chao-Wen Shih, Hao-Yi Tsai, Hsien-Wei Chen, Mirng-Ji Lii | 2014-03-11 |
| 8659170 | Semiconductor device having conductive pads and a method of manufacturing the same | Chen-Cheng Kuo, Chen-Shien Chen | 2014-02-25 |
| 8610267 | Reducing delamination between an underfill and a buffer layer in a bond structure | Ching-Jung Yang, Chang-Pin Huang, Michael Shou-Ming Tong, Ying-Ju Chen, Tung-Liang Shao +3 more | 2013-12-17 |
| 8558229 | Passivation layer for packaged chip | Shin-Puu Jeng, Wei-Cheng Wu, Shang-Yun Hou, Chen-Hua Yu, Tzu-Wei Chiu +1 more | 2013-10-15 |
| 8546941 | Multi-direction design for bump pad structures | Chih-Hua Chen, Chen-Shien Chen, Chen-Cheng Kuo | 2013-10-01 |
| 8434041 | Increasing dielectric strength by optimizing dummy metal distribution | Hsien-Wei Chen | 2013-04-30 |
| 8283781 | Semiconductor device having pad structure with stress buffer layer | Wei-Cheng Wu, Shang-Yun Hou, Shin-Puu Jeng, Tzu-Wei Chiu, Chao-Wen Shih | 2012-10-09 |
| 8227916 | Package structure and method for reducing dielectric layer delamination | Hsiu-Ping Wei, Shin-Puu Jeng, Hao-Yi Tsai, Hsien-Wei Chen, Yu-Wen Liu +1 more | 2012-07-24 |
| 8193639 | Dummy metal design for packaging structures | Shang-Yun Hou, Shin-Puu Jeng, Wei-Cheng Wu, Hsiu-Ping Wei, Chih-Hua Chen +3 more | 2012-06-05 |