Issued Patents All Time
Showing 51–75 of 100 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417629 | Three-dimensional stacking structure and manufacturing method thereof | Ming-Fa Chen, Sung-Feng Yeh, Chao-Wen Shih | 2022-08-16 |
| 11380653 | Die stack structure and manufacturing method thereof | Chen-Hua Yu, Hsien-Wei Chen, Ming-Fa Chen, Sung-Feng Yeh | 2022-07-05 |
| 11322477 | Package structure and method of fabricating the same | Ming-Fa Chen, Nien-Fang Wu, Sung-Feng Yeh, Chao-Wen Shih | 2022-05-03 |
| 11264362 | Semiconductor structure and method of fabricating the same | Ming-Fa Chen, Chao-Wen Shih, Min-Chien Hsiao, Nien-Fang Wu, Sung-Feng Yeh | 2022-03-01 |
| 11233035 | Package structure and method of manufacturing the same | Ming-Fa Chen, Sung-Feng Yeh, Chao-Wen Shih | 2022-01-25 |
| 11164848 | Semiconductor structure and method manufacturing the same | Ming-Fa Chen, Chao-Wen Shih, Min-Chien Hsiao, Sung-Feng Yeh, Chuan-An Cheng | 2021-11-02 |
| 11114413 | Stacking structure, package structure and method of fabricating the same | Ming-Fa Chen, Sung-Feng Yeh, Chao-Wen Shih | 2021-09-07 |
| 11107680 | Mask assembly and method for fabricating a chip package | Jie Chen, Hsien-Wei Chen, Ying-Ju Chen | 2021-08-31 |
| 11069608 | Semiconductor structure and manufacturing method thereof | Ming-Fa Chen, Sung-Feng Yeh, Chao-Wen Shih | 2021-07-20 |
| 11063022 | Package and manufacturing method of reconstructed wafer | Ming-Fa Chen, Chao-Wen Shih, Hsien-Wei Chen, Sung-Feng Yeh | 2021-07-13 |
| 11063019 | Package structure, chip structure and method of fabricating the same | Ming-Fa Chen, Sung-Feng Yeh, Chao-Wen Shih | 2021-07-13 |
| 11056438 | Semiconductor packages and method of forming the same | Ming-Fa Chen, Nien-Fang Wu, Sung-Feng Yeh, Chao-Wen Shih | 2021-07-06 |
| 11024605 | Integrated circuit package and method | Ming-Fa Chen, Chao-Wen Shih, Sung-Feng Yeh, Nien-Fang Wu | 2021-06-01 |
| 10978410 | Semiconductor structure and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen | 2021-04-13 |
| 10957610 | Integrated circuit component and package structure having the same | Chao-Hsiang Yang, Hsien-Wei Chen, Ming-Fa Chen | 2021-03-23 |
| 10950576 | Package structure | Hsien-Wei Chen, Jiun-Heng Wang, Ming-Fa Chen | 2021-03-16 |
| 10867929 | Semiconductor structures and methods of forming the same | Chen-Hua Yu, Ming-Fa Chen, Chao-Wen Shih, Sung-Feng Yeh | 2020-12-15 |
| 10867879 | Integrated circuit package and method | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen | 2020-12-15 |
| 10756010 | Semiconductor device packaging structure having through interposer vias and through substrate vias | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen | 2020-08-25 |
| 10734295 | Interposer test structures and methods | Chen-Hua Yu, Hsien-Pin Hu, Tzu-Yu Wang, Wei-Cheng Wu, Shang-Yun Hou +1 more | 2020-08-04 |
| 10510691 | Semiconductor structure and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen | 2019-12-17 |
| 10510650 | Method of manufacturing semiconductor device packaging structure having through interposer vias and through substrate vias | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen | 2019-12-17 |
| 10483174 | Integrated circuit component and package structure having the same | Chao-Hsiang Yang, Hsien-Wei Chen, Ming-Fa Chen | 2019-11-19 |
| 10468379 | 3DIC structure and method of manufacturing the same | Hsien-Wei Chen, Jiun-Heng Wang, Ming-Fa Chen | 2019-11-05 |
| 10262939 | Configurable routing for packaging applications | Chung-Yu Lu, Hsien-Pin Hu, Shin-Puu Jeng, Shang-Yun Hou, Shih-Wen Huang +1 more | 2019-04-16 |