Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125820 | Through-dielectric vias for direct connection and method forming same | Ming-Fa Chen, Sung-Feng Yeh, Chih-Chia Hu | 2024-10-22 |
| 11721663 | Multi-level stacking of wafers and chips | Ming-Fa Chen, Cheng-Feng Chen, Sung-Feng Yeh | 2023-08-08 |
| 11164848 | Semiconductor structure and method manufacturing the same | Ming-Fa Chen, Chao-Wen Shih, Min-Chien Hsiao, Sung-Feng Yeh, Tzuan-Horng Liu | 2021-11-02 |