Issued Patents All Time
Showing 1–25 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374652 | Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices | Yen-Ping Wang | 2025-07-29 |
| 12362282 | Semiconductor structure and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen | 2025-07-15 |
| 12322728 | Method of manufacturing die stack structure | Hsien-Wei Chen | 2025-06-03 |
| 12278199 | Conductive bump of a semiconductor device and fabricating method thereof cross reference to related applications | Chang-Pin Huang, Tung-Liang Shao, Hsien-Ming Tu, Yu-Chia Lai | 2025-04-15 |
| 12211823 | Semiconductor package with shared barrier layer in redistribution and via and method of manufacturing the same | Hsien-Wei Chen, Ming-Fa Chen, Sung-Feng Yeh, Ying-Ju Chen | 2025-01-28 |
| 12205856 | Semiconductor structure including interconnection to probe pad with probe mark | Hsien-Wei Chen, Jie Chen | 2025-01-21 |
| 12176257 | Semiconductor structure having an anti-arcing pattern disposed on a passivation layer | Sheng-An Kuo, Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2024-12-24 |
| 11837579 | Semiconductor structure | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2023-12-05 |
| 11837562 | Conductive bump of a semiconductor device and fabricating method thereof | Chang-Pin Huang, Tung-Liang Shao, Hsien-Ming Tu, Yu-Chia Lai | 2023-12-05 |
| 11784124 | Plurality of different size metal layers for a pad structure | Hsien-Wei Chen, Chia-Wei Tu | 2023-10-10 |
| 11769704 | Semiconductor structure having an anti-arcing pattern disposed on a passivation layer and a post passivation layer disposed on the anti-arcing pattern | Sheng-An Kuo, Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2023-09-26 |
| 11682594 | Semiconductor structure including interconnection to probe pad with probe mark | Hsien-Wei Chen, Jie Chen | 2023-06-20 |
| 11562935 | Semiconductor structure | Hsien-Wei Chen, Ming-Fa Chen | 2023-01-24 |
| 11532598 | Package structure with protective structure and method of fabricating the same | Hsien-Wei Chen, Ming-Fa Chen | 2022-12-20 |
| 11469200 | Semiconductor device and manufacturing method thereof | Tung-Liang Shao, Yu-Chia Lai, Hsien-Ming Tu, Chang-Pin Huang | 2022-10-11 |
| 11417599 | Plurality of different size metal layers for a pad structure | Hsien-Wei Chen, Chia-Wei Tu | 2022-08-16 |
| 11373953 | Semiconductor structure and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen | 2022-06-28 |
| 11362064 | Semiconductor package with shared barrier layer in redistribution and via | Hsien-Wei Chen, Ming-Fa Chen, Sung-Feng Yeh, Ying-Ju Chen | 2022-06-14 |
| 11335610 | Semiconductor structure including interconnection to probe pad with probe mark and method of manufacturing the same | Hsien-Wei Chen, Jie Chen | 2022-05-17 |
| 11329022 | Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices | Yen-Ping Wang | 2022-05-10 |
| 11251157 | Die stack structure with hybrid bonding structure and method of fabricating the same and package | Hsien-Wei Chen | 2022-02-15 |
| 11251100 | Semiconductor structure having an anti-arcing pattern disposed on a passivation layer and method of fabricating the semiconductor structure | Sheng-An Kuo, Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2022-02-15 |
| 11121084 | Integrated circuit device with through interconnect via and methods of manufacturing the same | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2021-09-14 |
| 10998293 | Method of fabricating semiconductor structure | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2021-05-04 |
| 10985121 | Bump structure and fabricating method thereof | Chang-Pin Huang, Tung-Liang Shao, Hsien-Ming Tu, Yu-Chia Lai | 2021-04-20 |