Issued Patents All Time
Showing 1–25 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159862 | Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices | Yian-Liang Kuo, Yi Wang | 2024-12-03 |
| 11791439 | Magnetic light-emitting structure | Hsiang-An FENG, Cheng-Yu Chung, Ya-Li Chen | 2023-10-17 |
| 11784124 | Plurality of different size metal layers for a pad structure | Hsien-Wei Chen, Ching-Jung Yang | 2023-10-10 |
| 11769861 | Light-emitting diode packaging structure and method for fabricating the same | Ai-Sen Liu, Hsiang-An FENG, Cheng-Yu Chung, Ya-Li Chen | 2023-09-26 |
| 11621368 | Magnetic light-emitting structure and fabrication method for manufacturing a magnetic light-emitting element | Hsiang-An FENG, Cheng-Yu Chung, Ya-Li Chen | 2023-04-04 |
| 11508872 | Alignment module for transferring a magnetic light-emitting die and alignment method thereof | Ai-Sen Liu, Hsiang-An FENG, Ya-Li Chen | 2022-11-22 |
| 11417599 | Plurality of different size metal layers for a pad structure | Hsien-Wei Chen, Ching-Jung Yang | 2022-08-16 |
| 11226363 | Reliability testing method and apparatus | Shiang-Ruei Su, Liang-Chen Lin | 2022-01-18 |
| 10944024 | Method for manufacturing micro light-emitting diode chips | Ray-Hua Horng, Hsiang-An FENG, Cheng-Yu Chung, Fu-Gow Tarntair | 2021-03-09 |
| 10867975 | Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices | Yian-Liang Kuo, Yi Wang | 2020-12-15 |
| 10770366 | Integrated circuit packages and methods for forming the same | Hsien-Wei Chen, Tsung-Fu Tsai, Wen-Hsiung Lu, Yian-Liang Kuo | 2020-09-08 |
| 10658290 | Plurality of different size metal layers for a pad structure | Hsien-Wei Chen, Ching-Jung Yang | 2020-05-19 |
| 10622510 | Vertical type light emitting diode die and method for fabricating the same | Ya-Li Chen, Chi-Ming Wang, Cheng-Yu Chung, Hsiang-An FENG | 2020-04-14 |
| 10622509 | Vertical type light emitting diode die and method for fabricating the same | Ya-Li Chen, Chi-Ming Wang, Cheng-Yu Chung, Hsiang-An FENG | 2020-04-14 |
| 10510635 | Integrated circuit packages and methods for forming the same | Hsien-Wei Chen, Tsung-Fu Tsai, Wen-Hsiung Lu, Yian-Liang Kuo | 2019-12-17 |
| 10495687 | Reliability testing method | Shiang-Ruei Su, Liang-Chen Lin | 2019-12-03 |
| 10453818 | Packaging structures of integrated circuits | Tsung-Fu Tsai, Yian-Liang Kuo, Ru-Ying Huang | 2019-10-22 |
| 10340258 | Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices | Yian-Liang Kuo, Yi Wang | 2019-07-02 |
| 10276496 | Plurality of different size metal layers for a pad structure | Hsien-Wei Chen, Ching-Jung Yang | 2019-04-30 |
| 10269750 | Methods and apparatus of packaging semiconductor devices | Yian-Liang Kuo, Tsung-Fu Tsai, Ru-Ying Huang, Ming-Song Sheu, Hsien-Wei Chen | 2019-04-23 |
| 10056312 | Integrated circuit packages and methods for forming the same | Hsien-Wei Chen, Tsung-Fu Tsai, Wen-Hsiung Lu, Yian-Liang Kuo | 2018-08-21 |
| 9780009 | Integrated circuit packages and methods for forming the same | Hsien-Wei Chen, Tsung-Fu Tsai, Wen-Hsiung Lu, Yian-Liang Kuo | 2017-10-03 |
| 9773732 | Method and apparatus for packaging pad structure | Hsien-Wei Chen, Ching-Jung Yang | 2017-09-26 |
| 9754908 | Wafer with liquid molding compound and post-passivation interconnect | Chung-Shi Liu, Ming-Da Cheng, Wen-Hsiung Lu, Yu-Peng Tsai | 2017-09-05 |
| 9698028 | Semiconductor package and method of manufacturing the same | Wen-Hsiung Lu, Ming-Da Cheng, Yi-Wen Wu, Yu-Peng Tsai, Chung-Shi Liu | 2017-07-04 |