| 12417964 |
Via-filling method of through-glass via substrate |
Hsiao-Lu CHEN, Ai-Sen Liu, Hsiang-An FENG |
2025-09-16 |
| 12418011 |
Bonding and transferring method for die package structures |
Hsiao-Lu CHEN, Ai-Sen Liu, Hsiang-An FENG |
2025-09-16 |
| 11981594 |
Quartz glass with low content of hydroxyl and high purity and method for preparing the same |
Ming Tang, Meng Wang, Yi QIAN, Jun Ma, Xian-Gen Zhang +1 more |
2024-05-14 |
| 11791439 |
Magnetic light-emitting structure |
Hsiang-An FENG, Chia-Wei Tu, Cheng-Yu Chung |
2023-10-17 |
| 11769861 |
Light-emitting diode packaging structure and method for fabricating the same |
Ai-Sen Liu, Hsiang-An FENG, Cheng-Yu Chung, Chia-Wei Tu |
2023-09-26 |
| 11621368 |
Magnetic light-emitting structure and fabrication method for manufacturing a magnetic light-emitting element |
Hsiang-An FENG, Chia-Wei Tu, Cheng-Yu Chung |
2023-04-04 |
| 11508872 |
Alignment module for transferring a magnetic light-emitting die and alignment method thereof |
Ai-Sen Liu, Hsiang-An FENG, Chia-Wei Tu |
2022-11-22 |
| 10622509 |
Vertical type light emitting diode die and method for fabricating the same |
Chi-Ming Wang, Chia-Wei Tu, Cheng-Yu Chung, Hsiang-An FENG |
2020-04-14 |
| 10622510 |
Vertical type light emitting diode die and method for fabricating the same |
Chi-Ming Wang, Chia-Wei Tu, Cheng-Yu Chung, Hsiang-An FENG |
2020-04-14 |
| D352873 |
Hand trowel |
— |
1994-11-29 |