Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417964 | Via-filling method of through-glass via substrate | Ai-Sen Liu, Hsiang-An FENG, Ya-Li Chen | 2025-09-16 |
| 12418011 | Bonding and transferring method for die package structures | Ai-Sen Liu, Hsiang-An FENG, Ya-Li Chen | 2025-09-16 |
| 12150242 | LED circuit board structure and LED testing and packaging method | Yi-Chuan HUANG, Ai-Sen Liu | 2024-11-19 |