Issued Patents All Time
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659890 | Methods and apparatus of packaging semiconductor devices | Yian-Liang Kuo, Tsung-Fu Tsai, Ru-Ying Huang, Ming-Song Sheu, Hsien-Wei Chen | 2017-05-23 |
| 9508617 | Test chip, test board and reliability testing method | Shiang-Ruei Su, Liang-Chen Lin | 2016-11-29 |
| 9368462 | Methods and apparatus of packaging semiconductor devices | Yi-Wen Wu, Ming-Che Ho, Wen-Hsiung Lu, Chung-Shi Liu | 2016-06-14 |
| 9196532 | Integrated circuit packages and methods for forming the same | Yian-Liang Kuo, Wen-Hsiung Lu, Hsien-Wei Chen, Tsung-Fu Tsai | 2015-11-24 |
| 9196559 | Directly sawing wafers covered with liquid molding compound | Yu-Peng Tsai, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2015-11-24 |
| 9136235 | Methods and apparatus of packaging semiconductor devices | Yian-Liang Kuo, Tsung-Fu Tsai, Ru-Ying Huang, Ming-Song Sheu, Hsien-Wei Chen | 2015-09-15 |
| 9082776 | Semiconductor package having protective layer with curved surface and method of manufacturing same | Wen-Hsiung Lu, Ming-Da Cheng, Yi-Wen Wu, Yu-Peng Tsai, Chung-Shi Liu | 2015-07-14 |
| 8994155 | Packaging devices, methods of manufacture thereof, and packaging methods | Tsung-Fu Tsai, Yu-Chang Lin, Ying-Ching Shih, Wei Wu, Yian-Liang Kuo | 2015-03-31 |
| 8937388 | Methods and apparatus of packaging semiconductor devices | Yi-Wen Wu, Ming-Che Ho, Wen-Hsiung Lu, Chung-Shi Liu | 2015-01-20 |
| 8846548 | Post-passivation interconnect structure and methods for forming the same | Yian-Liang Kuo, Wei-Lun Hsieh, Tsung-Fu Tsai | 2014-09-30 |
| 8569886 | Methods and apparatus of under bump metallization in packaging semiconductor devices | Yian-Liang Kuo, Tsung-Fu Tsai, Ru-Ying Huang, Ming-Song Sheu, Hsien-Wei Chen | 2013-10-29 |