Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11398467 | Methods for forming integrated circuit having guard rings | Jian-Hsing Lee, Yu-Chang Jong, Chun-Chien Tsai | 2022-07-26 |
| 10756079 | Methods for forming integrated circuit having guard rings | Jian-Hsing Lee, Yu-Chang Jong, Chun-Chien Tsai | 2020-08-25 |
| 10269750 | Methods and apparatus of packaging semiconductor devices | Chia-Wei Tu, Yian-Liang Kuo, Tsung-Fu Tsai, Ru-Ying Huang, Hsien-Wei Chen | 2019-04-23 |
| 9748361 | Integrated circuits using guard rings for ESD systems, and methods for forming the integrated circuits | Jian-Hsing Lee, Yu-Chang Jong, Chun-Chien Tsai | 2017-08-29 |
| 9659890 | Methods and apparatus of packaging semiconductor devices | Chia-Wei Tu, Yian-Liang Kuo, Tsung-Fu Tsai, Ru-Ying Huang, Hsien-Wei Chen | 2017-05-23 |
| 9620414 | Protecting flip-chip package using pre-applied fillet | Tsung-Fu Tsai, Yian-Liang Kuo, Yu-Ling Tsai, Chen-Shien Chen, Han-Ping Pu | 2017-04-11 |
| 9136235 | Methods and apparatus of packaging semiconductor devices | Chia-Wei Tu, Yian-Liang Kuo, Tsung-Fu Tsai, Ru-Ying Huang, Hsien-Wei Chen | 2015-09-15 |
| 9064881 | Protecting flip-chip package using pre-applied fillet | Tsung-Fu Tsai, Yian-Liang Kuo, Yu-Ling Tsai, Chen-Shien Chen, Han-Ping Pu | 2015-06-23 |
| 8772092 | Integrated circuits using guard rings for ESD, systems, and methods for forming the integrated circuits | Jian-Hsing Lee, Yu-Chang Jong, Chun-Chien Tsai | 2014-07-08 |
| 8569886 | Methods and apparatus of under bump metallization in packaging semiconductor devices | Chia-Wei Tu, Yian-Liang Kuo, Tsung-Fu Tsai, Ru-Ying Huang, Hsien-Wei Chen | 2013-10-29 |
| 8551835 | Electrostatic discharge protection device and method | Jian-Hsing Lee, Yao-Wu Feng | 2013-10-08 |
| 8378422 | Electrostatic discharge protection device comprising a plurality of highly doped areas within a well | Jian-Hsing Lee, Yao-Wu Feng | 2013-02-19 |
| 8344416 | Integrated circuits using guard rings for ESD, systems, and methods for forming the integrated circuits | Jian-Hsing Lee, Yu-Chang Jong, Chun-Chien Tsai | 2013-01-01 |