Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996368 | Pad structure for enhanced bondability | Yung Ching Chen, Yueh-Chiou Lin, Yian-Liang Kuo | 2024-05-28 |
| 11728279 | Pad structure for enhanced bondability | Yung Ching Chen, Yueh-Chiou Lin, Yian-Liang Kuo | 2023-08-15 |
| 11227836 | Pad structure for enhanced bondability | Yung Ching Chen, Yueh-Chiou Lin, Yian-Liang Kuo | 2022-01-18 |
| 10453818 | Packaging structures of integrated circuits | Tsung-Fu Tsai, Chia-Wei Tu, Yian-Liang Kuo | 2019-10-22 |
| 10269750 | Methods and apparatus of packaging semiconductor devices | Chia-Wei Tu, Yian-Liang Kuo, Tsung-Fu Tsai, Ming-Song Sheu, Hsien-Wei Chen | 2019-04-23 |
| 9659890 | Methods and apparatus of packaging semiconductor devices | Chia-Wei Tu, Yian-Liang Kuo, Tsung-Fu Tsai, Ming-Song Sheu, Hsien-Wei Chen | 2017-05-23 |
| 9607936 | Copper bump joint structures with improved crack resistance | Ching-Wen Hsiao, Jiun Yi Wu, Chen-Shien Chen | 2017-03-28 |
| 9136235 | Methods and apparatus of packaging semiconductor devices | Chia-Wei Tu, Yian-Liang Kuo, Tsung-Fu Tsai, Ming-Song Sheu, Hsien-Wei Chen | 2015-09-15 |
| 8847387 | Robust joint structure for flip-chip bonding | Ching-Wen Hsiao, Yao-Chun Chuang, Chen-Shien Chen, Chen-Cheng Kuo | 2014-09-30 |
| 8569886 | Methods and apparatus of under bump metallization in packaging semiconductor devices | Chia-Wei Tu, Yian-Liang Kuo, Tsung-Fu Tsai, Ming-Song Sheu, Hsien-Wei Chen | 2013-10-29 |