Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996368 | Pad structure for enhanced bondability | Ru-Ying Huang, Yueh-Chiou Lin, Yian-Liang Kuo | 2024-05-28 |
| 11804826 | Semiconductor devices with flexibility in capacitor design for power noise reduction | Zhigang Duan, Chang LIANG, Jinghao Chen | 2023-10-31 |
| 11728279 | Pad structure for enhanced bondability | Ru-Ying Huang, Yueh-Chiou Lin, Yian-Liang Kuo | 2023-08-15 |
| RE49045 | Package on package devices and methods of packaging semiconductor dies | Chen-Hua Yu, Chien-Hsun Lee | 2022-04-19 |
| 11227836 | Pad structure for enhanced bondability | Ru-Ying Huang, Yueh-Chiou Lin, Yian-Liang Kuo | 2022-01-18 |
| 11139281 | Molded underfilling for package on package devices | Chen-Hua Yu, Chien-Hsun Lee, Jung Wei Cheng, Tsung-Ding Wang, Ming-Da Cheng | 2021-10-05 |
| 10090345 | Interconnect structure for CIS flip-chip bonding and methods for forming the same | Chen-Hua Yu, Chien-Hsun Lee, Mirng-Ji Lii | 2018-10-02 |
| 10020286 | Package on package devices and methods of packaging semiconductor dies | Chien-Hsun Lee, Chen-Hua Yu, Jiun Yi Wu, Ming-Da Cheng, Mirng-Ji Lii | 2018-07-10 |
| 9768105 | Rigid interconnect structures in package-on-package assemblies | Mirng-Ji Lii, Chen-Hua Yu, Chien-Hsiun Lee, Jiun Yi Wu | 2017-09-19 |
| 9632516 | Gas-supply system and method | Yung-Long Chen, Chun-Feng Hsu, Heng-Yi Tseng, Chieh-Jan HUANG, Chin-Hsing Su | 2017-04-25 |
| 9397137 | Interconnect structure for CIS flip-chip bonding and methods for forming the same | Chen-Hua Yu, Chien-Hsun Lee, Mirng-Ji Lii | 2016-07-19 |
| 9362197 | Molded underfilling for package on package devices | Chen-Hua Yu, Chien-Hsun Lee, Jung Wei Cheng, Tsung-Ding Wang, Ming-Da Cheng | 2016-06-07 |
| 9171790 | Package on package devices and methods of packaging semiconductor dies | Chen-Hua Yu, Chien-Hsun Lee, Jiun Yi Wu, Mirng-Ji Lii, Ming-Da Cheng | 2015-10-27 |
| 8927877 | Looped interconnect structure | Hsin-An Shen, Ming-Chung Sung, Chih-Hang Tung, Chien-Hsun Lee, Da-Yuan Shih | 2015-01-06 |
| 8890274 | Interconnect structure for CIS flip-chip bonding and methods for forming the same | Chen-Hua Yu, Chien-Hsun Lee, Mirng-Ji Lii | 2014-11-18 |
| 8796132 | System and method for forming uniform rigid interconnect structures | Ming-Chung Sung, Chien-Hsun Lee, Chen-Hua Yu, Mirng-Ji Lii | 2014-08-05 |
| 8642393 | Package on package devices and methods of forming same | Chen-Hua Yu, Mirng-Ji Lii, Chien-Hsun Lee, Jiun Yi Wu | 2014-02-04 |
| 7337759 | Engine | Chih-Chieh Chen | 2008-03-04 |
| 6662764 | Two stroke engine | Chih-Chieh Chen | 2003-12-16 |