Issued Patents All Time
Showing 1–25 of 101 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12418982 | Laminated structure with pads and manufacturing method thereof | Hao-Cheng Hou, Jung Wei Cheng, Chien-Hsun Chen, Chien-Hsun Lee | 2025-09-16 |
| 12417968 | Package structure and forming method thereof | Chin-Liang Chen, Chi-Yang Yu, Yu-Min Liang, Hao-Cheng Hou, Jung Wei Cheng | 2025-09-16 |
| 12412846 | Semiconductor package and methods of fabricating a semiconductor package | Chin-Liang Chen, Hao-Cheng Hou, Yu-Min Liang, Jung Wei Cheng | 2025-09-09 |
| 12362321 | Semiconductor package | Yen-Fu Su, Hao-Cheng Hou, Jung Wei Cheng, Chien-Hsun Lee, Hsin-Yu Pan | 2025-07-15 |
| 12345740 | Probe card substrate, substrate structure and method of fabricating the same | Wei-Yu Chen, Yu-Min Liang, Hao-Cheng Hou, Chien-Hsun Lee, Chung-Shi Liu +1 more | 2025-07-01 |
| 12218021 | Semiconductor packages and methods of forming the same | Jung Wei Cheng, Jiun Yi Wu, Hsin-Yu Pan, Yu-Min Liang, Wei-Yu Chen | 2025-02-04 |
| 12199065 | Multi-die package structures including redistribution layers | Chen-Hua Yu, Kuo-Chung Yee, Chien-Hsun Lee | 2025-01-14 |
| 12183682 | Semiconductor package and manufacturing method thereof | Chien-Hsun Chen, Chien-Hsun Lee, Chung-Shi Liu, Jiun Yi Wu, Shou-Yi Wang | 2024-12-31 |
| 12142560 | Semiconductor packages and methods of forming same | Chung-Shi Liu, Chien-Hsun Lee, Jiun Yi Wu, Hao-Cheng Hou, Hung-Jen Lin +3 more | 2024-11-12 |
| 11961777 | Package structure comprising buffer layer for reducing thermal stress and method of forming the same | Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hao-Cheng Hou, Hung-Jui Kuo +3 more | 2024-04-16 |
| 11894341 | Semiconductor package with through vias and stacked redistribution layers and manufacturing method thereof | Yen-Fu Su, Hao-Cheng Hou, Jung Wei Cheng, Chien-Hsun Lee, Hsin-Yu Pan | 2024-02-06 |
| 11705378 | Semiconductor packages and methods of forming the same | Jung Wei Cheng, Jiun Yi Wu, Hsin-Yu Pan, Yu-Min Liang, Wei-Yu Chen | 2023-07-18 |
| 11652086 | Packages with stacked dies and methods of forming the same | Chien-Hsun Lee, Mirng-Ji Lii, Chen-Hua Yu | 2023-05-16 |
| 11538761 | Semiconductor package having molded die and semiconductor die and manufacturing method thereof | Hao-Cheng Hou, Wei-Yu Chen, Jung Wei Cheng, Chien-Hsun Lee, Chung-Shi Liu | 2022-12-27 |
| 11424199 | Connector formation methods and packaged semiconductor devices | Jung Wei Cheng, Hai-Ming Chen, Chien-Hsun Lee, Hao-Cheng Hou, Hung-Jen Lin +2 more | 2022-08-23 |
| 11404342 | Package structure comprising buffer layer for reducing thermal stress and method of forming the same | Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hao-Cheng Hou, Hung-Jui Kuo +3 more | 2022-08-02 |
| 11270921 | Semiconductor package including dies having high-modulus dielectric layer and manufacturing method thereof | Hao-Cheng Hou, Chien-Hsun Lee, Chung-Shi Liu, Jung Wei Cheng, Yi-Yang Lei | 2022-03-08 |
| 11244879 | Semiconductor package | Chi-Yang Yu, Chien-Hsun Lee, Jung Wei Cheng, Yu-Min Liang | 2022-02-08 |
| 11158614 | Thermal performance structure for semiconductor packages and method of forming same | Jung Wei Cheng, Mirng-Ji Lii, Chien-Hsun Lee | 2021-10-26 |
| 11145639 | Semiconductor package and manufacturing method thereof | Jung Wei Cheng, Chien-Hsun Lee, Chi-Yang Yu, Hao-Cheng Hou, Hsin-Yu Pan | 2021-10-12 |
| 11139281 | Molded underfilling for package on package devices | Chen-Hua Yu, Chien-Hsun Lee, Jung Wei Cheng, Ming-Da Cheng, Yung Ching Chen | 2021-10-05 |
| 11101209 | Redistribution structures in semiconductor packages and methods of forming same | Chung-Shi Liu, Chien-Hsun Lee, Jiun Yi Wu, Hao-Cheng Hou, Hung-Jen Lin +3 more | 2021-08-24 |
| 11088069 | Semiconductor package and semiconductor device | Hao-Cheng Hou, Chien-Hsun Lee, Chung-Shi Liu, Jung Wei Cheng | 2021-08-10 |
| 10867878 | Dam for three-dimensional integrated circuit | An-Jhih Su, Chien Ling Hwang, Jung Wei Cheng, Hsin-Yu Pan, Chen-Hua Yu | 2020-12-15 |
| 10867949 | Substrate design for semiconductor packages and method of forming same | Jung Wei Cheng, Mirng-Ji Lii, Chien-Hsun Lee, Chen-Hua Yu | 2020-12-15 |