Issued Patents All Time
Showing 51–75 of 101 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9881898 | System in package process flow | Chien-Hsun Lee | 2018-01-30 |
| 9859252 | Cooling channels in 3DIC stacks | Kai-Ming Ching, Ching-Wen Hsiao, Ming Hung Tseng, Chen-Shien Chen | 2018-01-02 |
| 9859267 | Package structures and methods of forming the same | Hao-Cheng Hou, Ming-Che Liu, Chun-Chih Chuang, Jung Wei Cheng, Hung-Jen Lin | 2018-01-02 |
| 9859266 | Method of forming 3D integrated circuit package with panel type lid | Kim Hong Chen, Jung Wei Cheng, Chien Ling Hwang, Hsin-Yu Pan, Han-Ping Pu | 2018-01-02 |
| 9837292 | Underfill dispensing with controlled fillet profile | Chun-Chih Chuang, Jung Wei Cheng, Chun-Hung Lin | 2017-12-05 |
| 9824902 | Integrated fan-out package and method of fabricating the same | Hao-Cheng Hou, Chien-Hsun Lee, Chen-Hua Yu, Chung-Shi Liu, Jung Wei Cheng +2 more | 2017-11-21 |
| 9806042 | Strain reduced structure for IC packaging | Hsien-Wei Chen, Ying-Ju Chen, Tsung-Yuan Yu, Yu-Feng Chen | 2017-10-31 |
| 9793242 | Packages with die stack including exposed molding underfill | Yu-Chih Liu, Hai-Ming Chen, Wei-Ting Lin, Jing Ruei Lu | 2017-10-17 |
| 9780064 | Method of forming package assembly | Hung-Jen Lin, Chien-Hsiun Lee, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2017-10-03 |
| 9768145 | Methods of forming multi-die package structures including redistribution layers | Chen-Hua Yu, Kuo-Chung Yee, Chien-Hsun Lee | 2017-09-19 |
| 9754917 | Method of forming wafer-level molded structure for package assembly | Bo-I Lee, Chien-Hsun Lee | 2017-09-05 |
| 9721916 | Concentric bump design for the alignment in die stacking | Jung Wei Cheng, Chien-Hsun Lee | 2017-08-01 |
| 9691723 | Connector formation methods and packaged semiconductor devices | Jung Wei Cheng, Hai-Ming Chen, Chien-Hsun Lee, Hao-Cheng Hou, Hung-Jen Lin +2 more | 2017-06-27 |
| 9673174 | Through silicon via bonding structure | Chen-Shien Chen, Kai-Ming Ching, Bo-I Lee, Chien-Hsun Lee | 2017-06-06 |
| 9673158 | Formation of connectors without UBM | Hung-Jen Lin, Chien-Hsun Lee | 2017-06-06 |
| 9653443 | Thermal performance structure for semiconductor packages and method of forming same | Jung Wei Cheng, Mirng-Ji Lii, Chien-Hsun Lee | 2017-05-16 |
| 9570368 | Method of manufacturing semiconductor package including forming a recessed region in a substrate | Jung Wei Cheng, Bo-I Lee | 2017-02-14 |
| 9564416 | Package structures and methods of forming the same | Hao-Cheng Hou, Ming-Che Liu, Chun-Chih Chuang, Jung Wei Cheng, Hung-Jen Lin | 2017-02-07 |
| 9502383 | 3D integrated circuit package processing with panel type lid | Han-Ping Pu, Kim Hong Chen, Jung Wei Cheng, Chien Ling Hwang, Hsin-Yu Pan | 2016-11-22 |
| 9496189 | Stacked semiconductor devices and methods of forming same | Chen-Hua Yu, Chien-Hsun Lee, Jung Wei Cheng | 2016-11-15 |
| 9455236 | Integrated circuit packages and methods of forming same | Chen-Hua Yu, Chien-Hsun Lee, Jung Wei Cheng | 2016-09-27 |
| 9437551 | Concentric bump design for the alignment in die stacking | Jung Wei Cheng, Chien-Hsun Lee | 2016-09-06 |
| 9406632 | Semiconductor package including a substrate with a stepped sidewall structure | Jung Wei Cheng, Bo-I Lee | 2016-08-02 |
| 9362197 | Molded underfilling for package on package devices | Chen-Hua Yu, Chien-Hsun Lee, Jung Wei Cheng, Ming-Da Cheng, Yung Ching Chen | 2016-06-07 |
| 9355933 | Cooling channels in 3DIC stacks | Kai-Ming Ching, Ching-Wen Hsiao, Ming Hung Tseng, Chen-Shien Chen | 2016-05-31 |