Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424562 | Three-dimensional (3D) package | Wei-Yu Chen, Kuan-Lin Ho, Yu-Min Liang, Jiun Yi Wu | 2025-09-23 |
| 12189299 | Digital lithography scan sequencing | Ying-Chiao Wang, Thomas Laidig, Frederick Lie, Chen-Yuan Hsieh, Chun-Cheng Yeh | 2025-01-07 |
| 12140871 | Gray tone uniformity control over substrate topography | YingChiao WANG, Chi-Ming Tsai, Yung Peng HU | 2024-11-12 |
| 11894312 | Semiconductor packages and method of manufacture | Wei-Yu Chen, Kuan-Lin Ho, Yu-Min Liang, Jiun Yi Wu | 2024-02-06 |
| 11688693 | Semiconductor packages and method of manufacture | Wei-Yu Chen, Kuan-Lin Ho, Yu-Min Liang, Jiun Yi Wu | 2023-06-27 |
| 11424199 | Connector formation methods and packaged semiconductor devices | Jung Wei Cheng, Hai-Ming Chen, Chien-Hsun Lee, Hao-Cheng Hou, Hung-Jen Lin +2 more | 2022-08-23 |
| 10522486 | Connector formation methods and packaged semiconductor devices | Jung Wei Cheng, Hai-Ming Chen, Chien-Hsun Lee, Hao-Cheng Hou, Hung-Jen Lin +2 more | 2019-12-31 |
| 10091892 | Laser direct imaging system and method for solder mask exposure | Yung Peng HU | 2018-10-02 |
| 9859267 | Package structures and methods of forming the same | Hao-Cheng Hou, Ming-Che Liu, Jung Wei Cheng, Tsung-Ding Wang, Hung-Jen Lin | 2018-01-02 |
| 9837292 | Underfill dispensing with controlled fillet profile | Jung Wei Cheng, Chun-Hung Lin, Tsung-Ding Wang | 2017-12-05 |
| 9691723 | Connector formation methods and packaged semiconductor devices | Jung Wei Cheng, Hai-Ming Chen, Chien-Hsun Lee, Hao-Cheng Hou, Hung-Jen Lin +2 more | 2017-06-27 |
| 9564416 | Package structures and methods of forming the same | Hao-Cheng Hou, Ming-Che Liu, Jung Wei Cheng, Tsung-Ding Wang, Hung-Jen Lin | 2017-02-07 |
| 9318465 | Methods for forming a semiconductor device package | Jung Wei Cheng, Tsung-Ding Wang, Chien-Hsun Lee | 2016-04-19 |
| 9177835 | Underfill dispensing with controlled fillet profile | Chun-Hung Lin, Jung Wei Cheng, Tsung-Ding Wang | 2015-11-03 |
| 9006032 | Package on package structures and methods for forming the same | Jung Wei Cheng, Tsung-Ding Wang, Chien-Hsun Lee | 2015-04-14 |
| 8704354 | Package on package structures and methods for forming the same | Jung Wei Cheng, Tsung-Ding Wang, Chien-Hsun Lee | 2014-04-22 |
| 8658464 | Mold chase design for package-on-package applications | Jung Wei Cheng, Chien-Hsiun Lee, Tsung-Ding Wang | 2014-02-25 |