Issued Patents All Time
Showing 1–25 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424562 | Three-dimensional (3D) package | Wei-Yu Chen, Chun-Chih Chuang, Yu-Min Liang, Jiun Yi Wu | 2025-09-23 |
| 12417969 | Semiconductor structure and circuit structure | Chin-Liang Chen, Pei-Rong Ni, Chia-Min Lin, Yu-Min Liang, Jiun Yi Wu | 2025-09-16 |
| 12347802 | Die corner removal for underfill crack suppression in semiconductor die packaging | Wei-Yu Chen, Chi-Yang Yu, Chin-Liang Chen, Yu-Min Liang, Jiun Yi Wu | 2025-07-01 |
| 12165946 | Semiconductor package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Yu-Min Liang, Wen-Lin Chen | 2024-12-10 |
| 12062604 | Semiconductor structure and manufacturing method thereof | Chin-Liang Chen, Jiun Yi Wu, Chi-Yang Yu, Yu-Min Liang, Wei-Yu Chen | 2024-08-13 |
| 11972956 | Lid attach process and dispenser head | Chin-Liang Chen, Wei-Ting Lin, Yu-Chih Liu, Jason Shen | 2024-04-30 |
| 11908835 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Yu-Min Liang | 2024-02-20 |
| 11894312 | Semiconductor packages and method of manufacture | Wei-Yu Chen, Chun-Chih Chuang, Yu-Min Liang, Jiun Yi Wu | 2024-02-06 |
| 11824032 | Die corner removal for underfill crack suppression in semiconductor die packaging | Wei-Yu Chen, Chi-Yang Yu, Chin-Liang Chen, Yu-Min Liang, Jiun Yi Wu | 2023-11-21 |
| 11810847 | Package structure and method of fabricating the same | Chin-Liang Chen, Pei-Rong Ni, Chia-Min Lin, Yu-Min Liang, Jiun Yi Wu | 2023-11-07 |
| 11784106 | Semiconductor package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Yu-Min Liang, Wen-Lin Chen | 2023-10-10 |
| 11749594 | Semiconductor structure and manufacturing method thereof | Chin-Liang Chen, Jiun Yi Wu, Chi-Yang Yu, Yu-Min Liang, Wei-Yu Chen | 2023-09-05 |
| 11688693 | Semiconductor packages and method of manufacture | Wei-Yu Chen, Chun-Chih Chuang, Yu-Min Liang, Jiun Yi Wu | 2023-06-27 |
| 11616037 | Integrated fan-out package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Hai-Ming Chen, Yu-Min Liang | 2023-03-28 |
| 11594479 | Semiconductor structure and manufacturing method thereof | Chin-Liang Chen, Pei-Rong Ni, Chia-Min Lin, Yu-Min Liang, Jiun Yi Wu | 2023-02-28 |
| 11508640 | Semiconductor package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Yu-Min Liang, Wen-Lin Chen | 2022-11-22 |
| 11424220 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Yu-Min Liang | 2022-08-23 |
| 11417643 | Package-on-package with redistribution structure | Yu-Chih Liu, Wei-Ting Lin, Chin-Liang Chen, Jing Ruei Lu | 2022-08-16 |
| 11355461 | Integrated fan-out package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Hai-Ming Chen, Yu-Min Liang | 2022-06-07 |
| 11315862 | Semiconductor structure and manufacturing method thereof | Chin-Liang Chen, Jiun Yi Wu, Chi-Yang Yu, Yu-Min Liang, Wei-Yu Chen | 2022-04-26 |
| 11264304 | Semiconductor structure and associated method for manufacturing the same | Chin-Liang Chen, Chi-Yang Yu, Yu-Min Liang | 2022-03-01 |
| 11011431 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Chien-Kuo Chang, Chih-Hao Lin, Jung-Tsung Cheng | 2021-05-18 |
| 10957672 | Package structure and method of manufacturing the same | Chi-Yang Yu, Chin-Liang Chen, Chien-Hsun Lee, Yu-Min Liang | 2021-03-23 |
| 10879140 | System and method for bonding package lid | Shih-Yen Lin, Yu-Chih Liu, Chin-Liang Chen, Wei-Ting Lin | 2020-12-29 |
| 10867835 | Semiconductor packaging structure and process | Chin-Liang Chen, Wei-Ting Lin, Yu-Chih Liu, Shih-Yen Lin | 2020-12-15 |